Packaging for silicon sensors

  • US 6,028,773 A
  • Filed: 11/17/1997
  • Issued: 02/22/2000
  • Est. Priority Date: 11/14/1997
  • Status: Expired due to Term
First Claim
Patent Images

1. A packaged integrated circuit, comprising:

  • a substrate;

    an integrated circuit die positioned on said substrate, said integrated circuit die having a top surface and sides; and

    an adhesive surface coating applied to said substrate and said sides of said integrated circuit die for sealing said integrated circuit die to said substrate such that a substantial portion of said top surface of said die is exposed.

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