Ultrasound imaging probe assembly

• US 6,030,346 A
• Filed: 04/29/1998
• Issued: 02/29/2000
• Est. Priority Date: 02/21/1996
• Status: Expired due to Term

• Current Assignee: Tyco Electronics Services GmbH (TE Connectivity Ltd. (United Kingdom))
• Original Assignee: The Whitaker Corporation (Meggitt PLC)
• Inventors: Buck, Arthur Glen, Olson, Ronald A.
• Primary Examiner(s): Jaworski, Francis J.
• Application Number:
  US09/069,786
• Time in Patent Office: 671 Days
• Field of Search: 174/75 C, 174/102 R, 174/103-105, 174/107-108, 174/128.1, 174/128.2, 600/437, 600/443, 600/459, 600/462-463
• US Class Current: 600/459
• CPC Class Codes: B06B 1/0622 on one surface

Abstract

An ultrasound imaging probe assembly (1a) has multiple piezoelectric elements (3) producing an array of scanned ultrasound signals and being connected by insulated conductors (4) to an electronic scanner to convert the signals to an image, the insulated conductors (4) and an uninsulated conductor (15) are concentric with an inner conductor (8) and a conducting shield (7), and the insulated conductors (4) are capacitively coupled to the inner conductor (8) and the shield (7) to provide an ultrasound transducer assembly (1) of compact size.

Claims

1. An ultrasound diagnostic probe assembly comprising:

multiple piezoelectric elements producing an array of scanned ultrasound signals,

at least one row of insulated, signal transmitting conductors electrically connecting the piezoelectric elements to an electronic scanner that converts the signals to an image,

at least one uninsulated conductor in said row together with said signal transmitting conductors,

each of the signal transmitting conductors and said at least one uninsulated conductor being in contact with a flexible inner conductor,

a flexible conducting shield encircling the signal transmitting conductors and said at least one uninsulated conductor, the shield defining an inner circumference within which the signal transmitting conductors and said at least one uninsulated conductor are free to move and to undergo flexure while the signal transmitting conductors engage the shield and the flexible inner conductor,

the signal transmitting conductors tending to cross talk among themselves,

the shield and the inner conductor being commoned together,

circuitry between, first, the piezoelectric elements and, second, the signal transmitting conductors and said at least one uninsulated conductor, said at least one uninsulated conductor being connected to a ground bus on the circuitry to eliminate the need for connecting the shield to the ground bus,

the signal transmitting conductors each engaging both the inner conductor and the shield while being free to move within said inner circumference, and

the signal transmitting conductors each further being purposely capacitance coupled with both the inner conductor and the shield to reduce cross talk among themselves.

2. An ultrasound diagnostic probe assembly as recited in claim 1, wherein the signal transmitting conductors and said at least one uninsulated conductor extend helically over the flexible inner conductor.

3. An ultrasound diagnostic probe assembly as recited in claim 1, wherein the signal transmitting conductors and said at least one uninsulated conductor helically extend over the flexible inner conductor, and the shield extends helically and encircles the signal transmitting conductors and said at least one uninsulated conductor.

4. An ultrasound diagnostic probe assembly as recited in claim 1, and further comprising:

at least a second row of insulated, signal transmitting conductors electrically connecting respective piezoelectric elements to the electronic scanner that converts the signals to an image,

at least one uninsulated conductor in said second row together with said signal transmitting conductors,

a second flexible conducting shield encircling the signal transmitting conductors and said at least one uninsulated conductor of the second row, the second flexible conducting shield defining an inner circumference within which the signal transmitting conductors and said at least one uninsulated conductor of the second row are free to move and to undergo flexure while the signal transmitting conductors of the second row engage both of the flexible conducting shields,

the signal transmitting conductors of the second row tending to cross talk among themselves,

both flexible conducting shields and the inner conductor being commoned together,

circuitry between, first, the piezoelectric elements and, second, the signal transmitting conductors and said at least one uninsulated conductor of the second row,

said at least one uninsulated conductor of the second row being connected to a ground bus on the circuitry to eliminate the need for connecting the shield to the ground bus, and

the signal transmitting conductors of the second row each engaging both flexible conducting shields, and the signal transmitting conductors of the second row each further being purposely capacitance coupled with both flexible conducting shields to reduce cross talk among themselves.

5. A diagnostic probe assembly comprising:

multiple piezoelectric elements producing an array of scanned sound signals,

at least one row of insulated, signal transmitting conductors for electrically connecting the piezoelectric elements to an electronic scanner that converts the sound signals to an image,

at least one uninsulated conductor in said row together with said signal transmitting conductors,

each of the signal transmitting conductors and at least one uninsulated conductor encircling a flexible inner conductor,

a flexible conducting shield encircling the signal transmitting conductors and said at least one uninsulated conductor, the shield defining an inner circumference within which the signal transmitting conductors and said at least one uninsulated conductor are free to move and to undergo flexure while the signal transmitting conductors engage the shield and the inner conductor,

the signal transmitting conductors tending to cross talk among themselves,

the shield and the inner conductor being commoned together,

circuitry between, first, the piezoelectric elements and, second, the signal transmitting conductors and said at least one uninsulated conductor, said at least one uninsulated conductor being connected to a ground bus on the circuitry to eliminate the need for connecting the shield to the ground bus,

the signal transmitting conductors and said at least one uninsulated conductor each engaging both the inner conductor and the shield while being free to move in said inner circumference, and

the signal transmitting conductors each further being purposely capacitance coupled with both the inner conductor and the shield to reduce cross talk among themselves.

6. A diagnostic probe assembly as recited in claim 5, wherein the signal transmitting conductors and said at least one uninsulated conductor extend helically over the flexible inner conductor.

7. A diagnostic probe assembly as recited in claim 5, wherein the signal transmitting conductors and said at least one uninsulated conductor helically extend over the flexible inner conductor, and the shield extends helically and encircles the signal transmitting conductors and said at least one uninsulated conductor.

8. A diagnostic probe assembly as recited in claim 5, and further comprising:

at least a second row of insulated, signal transmitting conductors electrically connecting respective piezoelectric elements to the electronic scanner that converts the signals to an image,

at least one uninsulated conductor in said second row together with said signal transmitting conductors,

a second flexible conducting shield encircling the signal transmitting conductors and said at least one uninsulated conductor of the second row, the second flexible conducting shield defining an inner circumference within which the signal transmitting conductors and said at least one uninsulated conductor of the second row are free to move and to undergo flexure while the signal transmitting conductors of the second row engage both of the flexible conducting shields,

the signal transmitting conductors of the second row tending to cross talk among themselves,

both flexible conducting shields and the inner conductor being commoned together, and connected to the ground or reference electrical potential,

circuitry between, first, the piezoelectric elements and, second, the signal transmitting conductors and said at least one uninsulated conductor of the second row,

said at least one uninsulated conductor of the second row being connected to a ground bus on the circuitry to eliminate the need for connecting the shield to the ground bus, and

the signal transmitting conductors and said at least one uninsulated conductor of the second row each engaging both flexible conducting shields, and the signal transmitting conductors of the second row each further being purposely capacitance coupled with both flexible conducting shields to reduce cross talk among themselves.