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Surface treatment of copper

  • US 6,036,758 A
  • Filed: 08/10/1998
  • Issued: 03/14/2000
  • Est. Priority Date: 08/10/1998
  • Status: Expired due to Fees
First Claim
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1. A composition useful for the surface treatment of copper, said composition comprising 0.5 to 5% w/v hydrogen peroxide and 0.01 to 5% w/v of an aromatic sulfonic acid or a salt thereof.

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