Surface treatment of copper
First Claim
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1. A composition useful for the surface treatment of copper, said composition comprising 0.5 to 5% w/v hydrogen peroxide and 0.01 to 5% w/v of an aromatic sulfonic acid or a salt thereof.
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Abstract
A composition useful for the surface treatment of copper, in particular for micro-roughening of the copper surface so as to improve the adhesion characteristics of the copper surface, comprises an oxidizing agent for copper and an aromatic sulfonic acid or a salt thereof. In a preferred embodiment, the oxidizing agent is hydrogen peroxide and the aromatic sulfonic acid is sodium m-nitrobenzenesulfonate. The composition preferably also includes an inorganic acid such as sulfuric acid and a corrosion inhibitor such as benzotriazole.
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21 Claims
- 1. A composition useful for the surface treatment of copper, said composition comprising 0.5 to 5% w/v hydrogen peroxide and 0.01 to 5% w/v of an aromatic sulfonic acid or a salt thereof.
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