Selectively sized spacers
DC CAFCFirst Claim
Patent Images
1. A method for forming a device comprising:
- forming at least one spacer adjacent to an edge of each of a plurality of gates on a substrate, the plurality of gates including a first gate and at least one remaining gate;
applying a mask to the first gate, including at least a portion of said at least one spacer for the first gate;
etching and therein sizing said at least one spacer for each of the at least one remaining gate into a geometry that is smaller than the at least one spacer for the first gate;
removing the mask from the first gate; and
applying an ion implantation and forming a highly doped region within the substrate adjacent to the sized at least one spacer.
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Abstract
The formation of selectively sized spacers is disclosed. One embodiment comprises a method including four steps. In the first step, at least one spacer for each of a plurality of gates is formed on a substrate, the plurality of gates including a first gate and at least one remaining gate, and each spacer adjacent to an edge of its corresponding gate. In the second step, a mask is applied to the first gate, including the spacers for the first gate. In the third step, the spacers for the remaining gates are etched. In the fourth step, the mask applied to the first gate, including the spacers for the first gate, is removed.
13 Citations
18 Claims
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1. A method for forming a device comprising:
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forming at least one spacer adjacent to an edge of each of a plurality of gates on a substrate, the plurality of gates including a first gate and at least one remaining gate; applying a mask to the first gate, including at least a portion of said at least one spacer for the first gate; etching and therein sizing said at least one spacer for each of the at least one remaining gate into a geometry that is smaller than the at least one spacer for the first gate; removing the mask from the first gate; and applying an ion implantation and forming a highly doped region within the substrate adjacent to the sized at least one spacer. - View Dependent Claims (2, 3, 4, 6, 7, 8, 18)
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5. A method for forming a device comprising:
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forming at least one spacer adjacent to an edge of each of a plurality of gates on a substrate, the plurality of gates including a first gate and at least one remaining gate; applying a mask to the first gate, including at least a portion of said at least one spacer for the first gate; etching and therein sizing said at least one spacer for each of the at least one remaining gate into a geometry that is smaller than the at least one spacer for the first gate; removing the mask from the first gate; and
applying an ion implantation and forming a highly doped region within the substrate adjacent to the sized at least one spacer; andprior to forming at least one spacer for each of a plurality of gates on a substrate, applying an ion implantation and forming a lightly doped region within the substrate adjacent to each edge of each gate.
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9. A method for forming a device comprising:
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forming at least one spacer adjacent to an edge of each of a plurality of gates on a substrate, the plurality of gates including a first gate and at least one remaining gate; applying a mask to the first gate, including at least a portion of said at least one spacer for the first gate; etching and therein sizing said at least one spacer for each of the at least one remaining gate into a geometry that is smaller than the at least one spacer for the first gate; removing the mask from the first gate; and
applying an ion implantation and forming a highly doped region within the substrate adjacent to the sized at least one spacer; andforming a third gate on the substrate having a spacer of the smaller geometry. - View Dependent Claims (10, 11, 13, 15)
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12. A method for forming a device comprising:
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forming at least one spacer adjacent to an edge of each of a plurality of gates on a substrate, the plurality of gates including a first gate and at least one remaining gate; applying a mask to the first gate, including at least a portion of said at least one spacer for the first gate; etching and therein sizing said at least one spacer for each of the at least one remaining gate into a geometry that is smaller than the at least one spacer for the first gate; removing the mask from the first gate; and
applying an ion implantation and forming a highly doped region within the substrate adjacent to the sized at least one spacer; andforming comprises forming a highly doped region within the substrate adjacent to each first spacer and each second spacer.
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14. A method for forming a device comprising:
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forming at least one spacer adjacent to an edge of each of a plurality of gates on a substrate, the plurality of gates including a first gate and at least one remaining gate; applying a mask to the first gate, including at least a portion of said at least one spacer for the first gate; etching and therein sizing said at least one spacer for each of the at least one remaining gate into a geometry that is smaller than the at least one spacer for the first gate; removing the mask from the first gate; and
applying an ion implantation and forming a highly doped region within the substrate adjacent to the sized at least one spacer; andwherein the first gate has a first channel length extending under the first gate and the at least one spacer, and the remaining gate has a second channel length extending under the remaining gate and the at least one spacer of the remaining gate, such that the second channel length is less than the first channel length. - View Dependent Claims (17)
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16. A method for forming a device comprising:
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forming at least one spacer adjacent to an edge of each of a plurality of gates on a substrate, the plurality of gates including a first gate and at least one remaining gate; applying a mask to the first gate, including at least a portion of said at least one spacer for the first gate; etching and therein sizing said at least one spacer for each of the at least one remaining gate into a geometry that is smaller than the at least one spacer for the first gate; removing the mask from the first gate; and
applying an ion implantation and forming a highly doped region within the substrate adjacent to the sized at least one spacer; andwherein each spacer of the first gate has a first triangular geometry, and each spacer of the remaining gate has a second triangular geometry.
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Specification