Curable polyphenylene ether-thermosetting resin composition and process

  • US 6,051,662 A
  • Filed: 08/20/1998
  • Issued: 04/18/2000
  • Est. Priority Date: 11/12/1996
  • Status: Expired due to Fees
First Claim
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1. A curable resin composition comprising:

  • (a) at least one polyphenylene ether resin having a number average molecular weight between about 500 to about 2,900 and(b) at least one thermosetting resin selected from the group consisting of phenolic, alkyds, polyester, polyurethane, mineral filled silicone, and benzocyclobutene resins.

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