Method of making a compliant multichip package
DCFirst Claim
1. A method of making a multichip package comprising the steps of:
- (a) providing a substrate having a plurality of conductive traces and flexible leads connected to outer ends of at least some of said conductive traces adjacent the periphery of said substrate, said substrate including conductive terminals accessible at a surface thereof connected to at least some of said conductive traces;
(b) providing a first microelectronic element having a front face including contacts and a back surface and assembling the front face thereof with said substrate;
(c) providing a second microelectronic element having a front face including contacts and assembling the second microelectronic element with the first microelectronic element and the substrate so that said second microelectronic element overlies said first microelectronic element;
(d) providing a compliant element between the second microelectronic element and the substrate; and
(e) electrically interconnecting said first and second microelectronic elements with one another and with said conductive terminals by connecting said flexible leads to the contacts of said second microelectronic element and connecting at least some of said traces to the contacts of said first microelectronic element.
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Litigations
1 Petition
Accused Products
Abstract
A method of making a multichip package includes providing a flexible substrate having a plurality of conductive traces and flexible leads connected to outer ends of the conductive traces adjacent the periphery of said flexible substrate. The flexible substrate includes conductive terminals accessible at a surface thereof connected to at least some of the conductive traces. The method includes providing a first microelectronic element having a front face including contacts and a back surface and assembling the front face thereof with the flexible substrate; depositing a compliant element over the back surface of the first microelectronic element; providing a second microelectronic element having a front face including contacts and assembling the front face thereof with the compliant element so that the second microelectronic element overlies the first microelectronic element; and electrically interconnecting the first and second microelectronic elements with one another and with the conductive terminals by connecting the flexible leads to the second microelectronic element and connecting at least some of the traces to the first microelectronic element.
223 Citations
39 Claims
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1. A method of making a multichip package comprising the steps of:
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(a) providing a substrate having a plurality of conductive traces and flexible leads connected to outer ends of at least some of said conductive traces adjacent the periphery of said substrate, said substrate including conductive terminals accessible at a surface thereof connected to at least some of said conductive traces; (b) providing a first microelectronic element having a front face including contacts and a back surface and assembling the front face thereof with said substrate; (c) providing a second microelectronic element having a front face including contacts and assembling the second microelectronic element with the first microelectronic element and the substrate so that said second microelectronic element overlies said first microelectronic element; (d) providing a compliant element between the second microelectronic element and the substrate; and (e) electrically interconnecting said first and second microelectronic elements with one another and with said conductive terminals by connecting said flexible leads to the contacts of said second microelectronic element and connecting at least some of said traces to the contacts of said first microelectronic element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A method of making a multichip package comprising the steps of:
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(a) providing a substrate having a plurality of conductive traces and flexible leads connected to outer ends of at least some of said conductive traces adjacent the periphery of said substrate, said substrate including conductive terminals accessible at a surface thereof connected to at least some of said conductive traces; (b) providing a first microelectronic element having a front face including contacts and a back surface and assembling the front face thereof with said substrate; (c) providing a second microelectronic element having a front face including contacts and assembling the second microelectronic element with the first microelectronic element and the substrate so that said second microelectronic element overlies said first microelectronic element; and (d) electrically interconnecting said first and second microelectronic elements with one another and with said conductive terminals by connecting said flexible leads to the contacts of said second microelectronic element and connecting at least some of said traces to the contacts of said first microelectronic element. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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Specification