Method of delaminating a pre-fabricated transistor layer from a substrate for placement on another wafer
First Claim
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1. A method of fabricating a film of active devices, the method comprising:
- a. forming first damaged regions in a substrate underneath first areas where active devices are to be formed;
b. forming said active devices onto said first areas;
c. forming second damaged regions, in said substrate, between said first damaged regions; and
d. causing said film to detach from a rest of said substrate at a location where said first and second damaged regions are formed.
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Abstract
A method of fabricating a film of active devices is provided. First damaged regions are formed, in a substrate, underneath first areas of the substrate where active devices are to be formed. Active devices are formed onto the first areas. Second damaged regions are formed, in the substrate, between the first damaged regions. The film is caused to detach from a rest of the substrate at a location where the first and second damaged regions are formed.
245 Citations
16 Claims
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1. A method of fabricating a film of active devices, the method comprising:
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a. forming first damaged regions in a substrate underneath first areas where active devices are to be formed; b. forming said active devices onto said first areas; c. forming second damaged regions, in said substrate, between said first damaged regions; and d. causing said film to detach from a rest of said substrate at a location where said first and second damaged regions are formed. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of fabricating a film of active devices, the method comprising the steps of:
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a forming active devices onto first areas of a substrate, said first areas separated by second areas; implanting a number of ions into said substrate, said number of ions including first and second number of ions, said first number of ions implanted at angles with said first areas, said first number of ions causing first damaged regions underneath said first areas at a depth from said first area, said second number of ions implanted perpendicularly to said second areas, said second number of ions causing second damaged regions at substantially the same depth underneath the second areas; and causing said film to detach from a rest of said substrate at a location substantially corresponding to said first and second damaged regions. - View Dependent Claims (14, 15, 16)
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Specification