Microelectric packages including flexible layers and flexible extensions, and liquid crystal display modules using the same

• US 6,061,246 A
• Filed: 07/27/1998
• Issued: 05/09/2000
• Est. Priority Date: 09/13/1997
• Status: Expired due to Term

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Cho, Hyun-sang, Oh, Choong-seob, Park, Jin-hyeok
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Vigushin, John B.
• Application Number:
  US09/123,570
• Time in Patent Office: 652 Days
• Field of Search: 361/749-751, 361/783, 361/789, 361/761, 361/762, 361/764, 361/777, 349/149-152, 174/254, 174/261, 439/67, 257/786, 29/832, 29/854
• US Class Current: 361/749
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/5386 Geometry or layout of the interconnection structure
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits

Abstract

The printed circuit board and tape carrier package of an LCD module are replaced with a microelectronic package that includes a substrate and a layer integrally formed on the substrate that is flexible relative to the substrate. The flexible layer includes at least one flexible extension that extends beyond the substrate. A plurality of conductive lines are included on the substrate that extend onto the flexible layer and extend along the flexible layer onto the at least one flexible extension. The conductive lines on the flexible extension are electrically connected to the data lines, the gate lines or both. Accordingly, tape carrier packages need not be used so that cost may be reduced. Moreover, separate operations to connect tape carrier packages to printed circuits boards may be eliminated, thereby improving reliability and/or cost of the device.

Claims

1. A microelectronic package for mounting microelectronic devices thereon, comprising:

a first substrate and a second substrate that is spaced apart from the first substrate;

an intermediary layer between the first and second spaced apart substrates, the intermediary layer being flexible relative to the first and second spaced apart substrates, the intermediary layer including at least one flexible extension that extends beyond the first and second spaced apart substrates;

a plurality of conductive lines on at least one of the first and second spaced apart substrates, that extend onto the flexible intermediary layer and extend along the flexible intermediary layer onto the at least one flexible extension; and

an integrated circuit mounting region;

wherein the first spaced apart substrate includes at least one aperture that exposes a first face of the intermediary layer, such that the second face of the intermediary layer that is opposite the first face of the intermediary layer exposed by the at least one aperture, is supported by the second spaced apart substrate; and

wherein the integrated circuit mounting region is on the first face of the intermediary layer exposed by the at least one aperture.

8. A microelectronic package according to claim 1 wherein the first and second spaced apart substrates are first and second printed circuit boards.

9. A microelectronic package according to claim 1 wherein the at least one flexible extension comprises a plurality of flexible extensions that extend in parallel beyond the first and second spaced apart substrates.

2. A microelectronic package for mounting microelectronic devices thereon, comprising:

a substrate;

a layer integrally formed on the substrate that is flexible relative to the substrate, the flexible layer including a plurality of flexible extensions that extend in parallel beyond the substrate;

a plurality of conductive lines on the substrate, that extend onto the flexible layer and extend along the flexible layer onto the plurality of flexible extensions; and

an integrated circuit mounting region;

wherein the substrate includes at least one aperture that exposes the flexible layer; and

wherein the integrated circuit mounting region is on the flexible layer exposed by the at least one aperture.

3. A microelectronic package according to claim 2 wherein the substrate is a printed circuit board.

4. A microelectronic package according to claim 2 further comprising a plurality of connecting pads on the plurality of flexible extensions, a respective one of which is connected to a respective one of the plurality of conductive lines.

7. A microelectronic package for mounting microelectronic devices thereon, comprising:

a first substrate and a second substrate that is spaced apart from the first substrate;

an intermediary layer between the first and second spaced apart substrates, the intermediary layer being flexible relative to the first and second spaced apart substrates, the intermediary layer including at least one flexible extension that extends beyond the first and second spaced apart substrates;

a plurality of conductive lines on at least one of the first and second spaced apart substrates, that extend onto the flexible intermediary layer and extend along the flexible intermediary layer onto the at least one flexible extension; and

a plurality of connecting pads on the at least one flexible extension, a respective one of which is connected to a respective one of the plurality of conductive lines, wherein the plurality of connecting pads are arranged in a plurality of repeated slanting lines on the at least one flexible extension.

10. A microelectronic package for mounting microelectronic devices thereon, comprising:

a substrate;

a layer integrally formed on the substrate that is flexible relative to the substrate, the flexible layer including at least one flexible extension that extends beyond the substrate;

a plurality of conductive lines on the substrate, that extend onto the flexible layer and extend along the flexible layer onto the at least one flexible extension;

an integrated circuit mounting region; and

a plurality of connecting pads on the at least one flexible extension, a respective one of which is connected to a respective one of the plurality of conductive lines;

wherein the substrate includes at least one aperture that exposes the flexible layer;

wherein the integrated circuit mounting region is on the flexible layer exposed by the at least one aperture; and

wherein the plurality of connecting pads are arranged in a plurality of repeated slanting lines on the at least one flexible extension.

11. A Liquid Crystal Display (LCD) module comprising:

an LCD panel including a plurality of spaced apart data lines and a plurality of spaced apart gate lines that intersect the data lines; and

a microelectronic package, comprising;

a first substrate and a second substrate that is spaced apart from the first substrate;

an intermediary layer between the first and second spaced apart substrates, the intermediary layer being flexible relative to the first and second spaced apart substrates, the intermediary layer including at least one flexible extension that extends beyond the first and second spaced apart substrates; and

a plurality of conductive lines on at least one of the first and second spaced apart substrates, that extend onto the flexible intermediary layer and extend along the flexible intermediary layer onto the at least one flexible extension, the plurality of conductive lines on the at least one flexible extension being electrically connected to the data lines, the gate lines or both the data lines and the gate lines.

5. A microelectronic package according to claim 14 wherein the plurality of connecting pads are nonlinearly arranged on the plurality of flexible extensions.

6. A microelectronic package according to claim 5 wherein the plurality of connecting pads are arranged in two rows of alternating pads on the plurality of flexible extensions.

12. An LCD module according to claim 11 wherein the first and second spaced apart substrates are first and second printed circuit boards.

13. An LCD module according to claim 11 wherein the at least one flexible extension comprises a plurality of flexible extensions that extend in parallel beyond the first and second spaced apart substrates.

14. An LCD module according to claim 11 further comprising:

a plurality of first connecting pads on the at least one flexible extension, a respective one of which is connected to a respective one of the plurality of conductive lines; and

a plurality of second connecting pads on the LCD panel, at locations corresponding to the plurality of first connecting pads, a respective one of the second connecting pads being connected to a respective one of the plurality of data lines or gate lines;

the plurality of first connecting pads being connected to the plurality of second connecting pads.

15. An LCD module according to claim 14 wherein the plurality of first connecting pads are nonlinearly arranged on the at least one flexible extension and wherein the plurality of second connecting pads are at corresponding nonlinearly arranged locations on the LCD panel.

16. An LCD module according to claim 14 wherein the plurality of first connecting pads are arranged in a plurality of repeated slanting lines on the at least one flexible extension and wherein the plurality of second connecting pads are arranged at a corresponding plurality of repeated slanting lines on the LCD panel.

17. An LCD module according to claim 14 wherein the plurality of first connecting pads are arranged in two rows of alternating pads on the at least one flexible extension and wherein the plurality of second connecting pads are arranged at a corresponding two rows of alternating pads on the LCD panel.

18. An LCD module according to claim 11 further comprising:

an integrated circuit mounting region on the microelectronic package; and

at least one integrated circuit mounted on the integrated circuit mounting region.

19. An LCD module according to claim 18 wherein the integrated circuit mounting region and the at least one integrated circuit are on one of the first and second spaced apart substrates, opposite the intermediary layer.

20. An LCD module according to claim 18:

wherein one of the first and second spaced apart substrates includes at least one aperture that exposes the intermediary layer; and

wherein the integrated circuit mounting region and the at least one integrated circuit are on the intermediary layer exposed by the at least one aperture.