Process for forming a semiconductor device

• US 6,068,668 A
• Filed: 03/31/1997
• Issued: 05/30/2000
• Est. Priority Date: 03/31/1997
• Status: Expired due to Term

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Mastroianni, Sal
• Primary Examiner(s): Monin, Jr., Donald L.
• Assistant Examiner(s): DIETRICH, MICHAEL C
• Application Number:
  US08/829,297
• Time in Patent Office: 1,156 Days
• Field of Search: 29/25.01, 414/935-940, 235/382, 454/187
• US Class Current: 29/25.01
• CPC Class Codes: H01L 21/67772 involving removal of lid, door, cover
• CPC Class Codes: H01L 21/67775 Docking arrangements
• CPC Class Codes: Y10S 414/135 Associated with semiconductor wafer handling
• CPC Class Codes: Y10S 414/137 including means for charging or discharging wafer cassette
• CPC Class Codes: Y10S 414/14 Wafer cassette transporting

Abstract

A method for forming a semiconductor device in a semiconductor device manufacturing apparatus (20) having a sensor (30) activated extensible shuttle (28). In a fabrication environment shuttle (28) is housed within semiconductor device manufacturing apparatus (20), where an outer door (32) is closed flush with an outer wall of the apparatus (20). As a substrate carrier (38) is moved near the apparatus (20), sensor (30) activates opening of outer door (32) and extension of shuttle (28) out of the apparatus (20) into the fabrication environment. In one embodiment, shuttle (28) has a sensor which is used to determine if carrier (38) is placed on shuttle (28) within a predetermined time, allowing retraction of shuttle (28) until it is required. The present invention increases the available operative space within the fabrication environment, and provides a clean mini-environment within apparatus (20).

Claims

1. A process for fabricating a semiconductor device comprising:

moving a substrate carrier near a port of a semiconductor device manufacturing apparatus, wherein;

the semiconductor device manufacturing apparatus has a first door and a first tray positioned internally; and

the substrate carrier has a shell and a carrier door;

sensing the substrate carrier with the semiconductor device manufacturing apparatus when near but before contacting the semiconductor device manufacturing apparatus, wherein sensing further comprises detecting a substrate carrier with a sensor unit contained within the semiconductor device manufacturing apparatus;

opening an outer door in response to sensing the substrate carrier when near but before contacting the semiconductor device manufacturing apparatus, the outer door positioned at the port of the semiconductor device manufacturing apparatus, the outer door being substantially flush with an outer wall of the semiconductor device manufacturing apparatus when closed;

in response to sensing, extending the first tray into a fabrication environment that lies outside of the semiconductor device manufacturing apparatus;

placing the substrate carrier including the shell onto the first tray while the first tray is extended into the fabrication environment; and

retracting the first tray into the semiconductor device manufacturing apparatus while the substrate carrier including the shell is on the first tray.

2. The process of claim 1, further comprising:

coupling the first door to the carrier door; and

moving the coupled doors to a first position which allows extraction of a first substrate from the substrate carrier.

3. The process of claim 2, further comprising performing an act selected from a group consisting of:

extracting the first substrate from the substrate carrier;

depositing a first film on the first substrate;

etching the first film on the first substrate;

heating the first substrate;

implanting the first substrate; and

patterning a resist layer over the first substrate.

4. The process of claim 1, wherein the sensor unit comprises:

a light sensor.

5. The process of claim 1, wherein the sensor unit comprises:

a radio frequency sensor.

6. The process of claim 1, wherein:

the substrate carrier has an information tag attached to an exterior of the substrate carrier; and

sensing the substrate carrier further comprises;

reading the information tag of the detected substrate carrier from the sensor unit.

7. The process of claim 6, wherein the information tag has substrate carrier processing and status information.

8. The process of claim 1, further comprising closing the outer door after a predetermined time period where the predetermined time period is initiated when opening the outer door.

9. The process of claim 1, further comprising:

closing the outer door subsequent to retracting the first tray.

10. The process of claim 1 wherein opening the outer door is performed a predetermined time period after sensing the substrate carrier.

11. The process of claim 1, wherein retracting the first tray is performed after a predetermined time period.

12. The process of claim 1 wherein moving comprises moving the substrate carrier near the port of the semiconductor device manufacturing apparatus the further comprises a second door and a second tray positioned internally.

13. The process of claim 12 further comprising determining a next substrate carrier for processing.

14. The process of claim 1 wherein:

the substrate carrier contains a plurality of substrates.

15. The process of claim 1 wherein moving the substrate carrier is performed by an automated guided vehicle (AGV).

16. The process of claim 1 wherein

the semiconductor device manufacturing apparatus is 100 times cleaner than the fabrication environment.

17. The process of claim 1, wherein:

the substrate carrier and first tray have complementary kinematic coupling features.

18. A process for fabricating a semiconductor device comprising:

moving a substrate carrier near a port of a semiconductor device manufacturing apparatus, wherein;

the semiconductor device manufacturing apparatus has a first door and a first tray positioned internally; and

the substrate carrier has a shell and a carrier door;

sensing the substrate carrier with the semiconductor device manufacturing apparatus when near but before contacting the semiconductor device manufacturing apparatus, wherein sensing further comprises detecting a substrate carrier with a sensor unit contained within the semiconductor device manufacturing apparatus;

opening an outer door in response to sensing the substrate carrier when near but before contacting the semiconductor device manufacturing apparatus, the outer door positioned at the port of the semiconductor device manufacturing apparatus, the outer door being substantially flush with an outer wall of the semiconductor device manufacturing apparatus when closed;

in response to sensing, extending the first tray into a fabrication environment that lies outside of the semiconductor device manufacturing apparatus;

placing the substrate carrier including the shell onto the first tray while the first tray is extended into the fabrication environment; and

retracting the first tray into the semiconductor device manufacturing apparatus while the substrate carrier including the shell is on the first tray.

19. The process of claim 18, further comprising performing an act selected from a group consisting of:

extracting the first substrate from the substrate carrier;

depositing a first film on the first substrate;

etching the first film on the first substrate;

heating the first substrate;

implanting the first substrate; and

patterning a resist layer over the first substrate.

20. The process of claim 18, wherein the sensor unit comprises:

a light sensor.

21. The process of claim 20, wherein the sensor unit comprises:

a radio frequency sensor.

22. The process of claim 18, wherein:

the substrate carrier has an information tag attached to an exterior of the substrate carrier; and

determining the substrate carrier is near further comprises;

reading the information tag of the detected substrate carrier from the sensor unit.

23. The process of claim 22, wherein the information tag has substrate carrier processing and status information.

24. The process of claim 18, further comprising:

closing the outer door after a predetermined time period where the predetermined time period is initiated when opening the outer door.

25. The process of claim 18, wherein opening the outer door is performed a predetermined time period after determining the substrate carrier is near.

26. The process of claim 18 wherein inserting comprises inserting the substrate carrier into the port of the semiconductor device manufacturing apparatus which further comprises a second door and a second tray positioned internally.

27. The process of claim 25 further comprising determining a next substrate carrier for processing.

28. The process of claim 18 wherein inserting the substrate carrier is performed by an automated guided vehicle (AGV).

29. The process of claim 18 wherein the first and second kinematic features have a substantially triangular shape when viewed in cross section.

30. The process of claim 18, wherein:

the substrate carrier and first tray have complementary kinematic coupling features.