Composition and slurry useful for metal CMP
DC CAFCFirst Claim
Patent Images
1. A chemical mechanical polishing composition precursor comprising the product of the mixture of at least one catalyst having multiple oxidation states and at least one stabilizer.
5 Assignments
Litigations
0 Petitions
Accused Products
Abstract
A chemical mechanical polishing precursor comprising at least one catalyst having multiple oxidation states, and at least one stabilizer, the composition being useful when admixed with an oxidizing agent prior to use to remove metal layers from a substrate.
190 Citations
18 Claims
- 1. A chemical mechanical polishing composition precursor comprising the product of the mixture of at least one catalyst having multiple oxidation states and at least one stabilizer.
-
10. A chemical mechanical polishing slurry precursor comprising an aqueous solution of from about 3.0 to about 7.0 weight percent silica, and the product of the admixture of from about 0.01 to about 0.05 weight percent ferric nitrate and from about 2 equivalents per catalyst to about 15 equivalents per catalyst of malonic acid.
-
11. A method for polishing a substrate including at least one metal layer comprising the steps of:
-
(a) admixing at least one catalyst having multiple oxidation states, at least one stabilizer, and deionized water to give a chemical mechanical polishing composition precursor; (b) admixing the chemical mechanical polishing composition precursor with an oxidizing agent to give a chemical mechanical polishing composition; (c) applying the chemical mechanical polishing composition to the substrate; and (d) removing at least a portion of the metal layer from the substrate by bringing a pad into contact with the substrate and moving the pad in relation to the substrate. - View Dependent Claims (12, 13, 14, 15, 16, 17)
-
-
18. A method for polishing a substrate including a tungsten containing metal layer comprising the steps of:
-
(a) admixing from about 3.0 to about 7.0 weight percent silica, from about 0.01 to about 0.05 weight percent ferric nitrate and from about 2 equivalents per catalyst to about 15 equivalents per catalyst of malonic acid to give a chemical mechanical polishing slurry precursor; (b) admixing the chemical mechanical polishing composition precursor with hydrogen peroxide to give a chemical mechanical polishing slurry including from about 0.5 to about 10.0 weight percent hydrogen peroxide; (c) applying the chemical mechanical polishing slurry to the substrate; and (d) removing at least a portion of the tungsten metal layer from the substrate by bringing a pad into contact with the substrate and moving the pad in relation to the substrate.
-
Specification