Method and apparatus for three dimensional inspection of electronic components

  • US 6,072,898 A
  • Filed: 01/16/1998
  • Issued: 06/06/2000
  • Est. Priority Date: 01/16/1998
  • Status: Expired due to Fees
First Claim
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1. An apparatus for inspecting a ball grid array, wherein the apparatus is calibrated using a precision pattern mask with dot patterns deposited on a calibration transparent reticle, the apparatus for inspecting a ball grid array comprising:

  • a) a means for mounting the ball grid array;

    b) a means for illuminating the ball grid array to provide an outline of the ball grid array;

    c) a first camera positioned to image the ball grid array to provide a first image of the ball grid array;

    d) a first means for light reflection positioned to reflect the ball grid array through a second means for light reflection into a second camera, wherein the second camera provides a second image of the ball grid array;

    e) a third means for light reflection positioned to reflect an opposite side view of the ball grid array into a fourth means for light reflection and into the second camera as part of the second image of the ball grid array;

    f) a means for image processing the first image and second image of the ball grid array to inspect the ball grid array; and

    g) a third camera, wherein the first camera enables direct imaging of a bottom view, wherein the first camera is located below a central area of the ball grid array, wherein the third camera is located to receive an image of a single side perspective view and uses fixed optical elements to magnify the single side perspective view in one dimension, wherein the second camera is positioned to image a second side perspective view and uses fixed optical elements to magnify the second side perspective view in one dimension, and wherein the means for image processing calculates a Z position of a ball on the ball grid array from the bottom view, first side perspective view and second side perspective view.

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