Ultrasonic phased array transducer with an ultralow impedance backfill and a method for making

• US 6,087,761 A
• Filed: 09/18/1998
• Issued: 07/11/2000
• Est. Priority Date: 06/19/1995
• Status: Expired due to Term

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Smith, Lowell Scott, Lorraine, Peter William
• Primary Examiner(s): Dougherty, Thomas M.
• Application Number:
  US09/157,295
• Time in Patent Office: 662 Days
• Field of Search: 310/322, 310/326, 310/327, 310/334, 310/335
• US Class Current: 310/334
• CPC Class Codes: B06B 1/0622 on one surface
• CPC Class Codes: B06B 1/0629 Square array
• CPC Class Codes: G10K 11/002 Devices for damping, suppressing, obstructing or conducting sound in acoustic devices G10K1/06 - G10K1/10 take precedence; for electro-mechanical transducers for communication H04R3/002
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/49007 Indicating transducer
• CPC Class Codes: Y10T 29/4908 Acoustic transducer
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49792 Dividing through modified portion

Abstract

The present invention discloses an ultrasonic phased array transducer with an ultralow backfill and a method for making. The ultrasonic phased array includes a low density backfill material having an ultralow acoustic impedance. The backfill material is either an aerogel, a carbon aerogel, an xerogel, or a carbon xerogel. A piezoelectric ceramic material and two matching layers are bonded to the backfill material. In one embodiment, a plurality of interconnect vias are formed in the backfill material with conducting material deposited in the vias. A portion of the bonded matching layers, the piezoelectric ceramic material, and the backfill material have isolation cuts therethrough to form an array of electrically and acoustically isolated individual elements. In a second embodiment, the backfill material is bonded to an electronic layer at a face opposite to the piezoelectric ceramic material and the matching layers. Then isolation cuts are made through the matching layers, the piezoelectric ceramic material, and the backfill material, to form an array of electrically and acoustically isolated individual elements.

Claims

1. An ultrasonic phased array transducer, comprising:

a low density backfill material having an ultralow acoustic impedance, wherein the backfill material is either a carbon aerogel or a carbon xerogel;

a piezoelectric ceramic material; and

a plurality of matching layers;

the piezoelectric ceramic material and the plurality of matching layers bonded to the backfill material, a portion of the bonded plurality of matching layers, the piezoelectric ceramic material, and the backfill material having cuts therethrough to form an array of electrically and acoustically isolated individual elements.

2. An ultrasonic phased array transducer according to claim 1, further comprising a plurality of interconnect vias formed in the backfill material.

3. An ultrasonic phased array transducer according to claim 2, further comprising a conducting material deposited in the plurality of interconnect vias.

4. An ultrasonic phased array transducer according to claim 1, further comprising an electronic layer bonded to the backfill material at a face opposite to the bonded piezoelectric ceramic material and plurality of matching layers, the electronic layer used for making electrical contacts to the piezoelectric ceramic material and to external devices.

5. An ultrasonic phased array transducer according to claim 4, wherein the cuts extend through the plurality of matching layers, the piezoelectric ceramic material, and the backfill material.

6. A method according to claim 1, wherein the backfill material has a density ranging from 0.02-0.2 gm·

cm^-3.

7. An ultrasonic phased array transducer, comprising:

a low density backfill material having an ultralow acoustic impedance, wherein the backfill material is an xerogel;

a piezoelectric ceramic material; and

a plurality of matching layers;

the piezoelectric ceramic material and the plurality of matching layers bonded to the backfill material, the backfill material having a plurality of interconnect vias formed therein, the plurality of interconnect vias having a conducting material deposited therein, a portion of the bonded plurality of matching layers, the piezoelectric ceramic material, and the backfill material having cuts therethrough to form an array of electrically and acoustically isolated individual elements.

8. An ultrasonic phased array transducer according to claim 7, wherein the backfill material has an acoustic impedance substantially less than 1 MRayl.

9. An ultrasonic phased array transducer according to claim 8, wherein the backfill material has an acoustic impedance less than 0.5 MRayl.

10. A method according to claim 7, wherein the backfill material has a density ranging from 0.02-0.2 gm·

cm^-3.

11. An ultrasonic phased array transducer, comprising:

an electrically conductive low density backfill material having an ultralow acoustic impedance, wherein the backfill material is either a carbon aerogel or a carbon xerogel;

a piezoelectric ceramic material; and

a plurality of matching layers;

the piezoelectric ceramic material and the plurality of matching layers bonded to the backfill material, the backfill material bonded to an electronic layer at a face opposite to the bonded piezoelectric ceramic material and a plurality of matching layers, the electronic layer used for making electrical contacts to the piezoelectric ceramic material and to external devices, a portion of the bonded plurality of matching layers, the piezoelectric ceramic material, and the backfill material having cuts therethrough to form an array of electrically and acoustically isolated individual elements.

12. An ultrasonic phased array transducer according to claim 11, wherein the cut portions extend through the plurality of matching layers, the piezoelectric ceramic material, and the backfill material.

13. An ultrasonic phased array transducer according to claim 12, wherein the backfill material has an acoustic impedance substantially less than 1 MRayl.

14. An ultrasonic phased array transducer according to claim 13, wherein the backfill material has an acoustic impedance less than 0.5 MRayl.

15. An ultrasonic phased array transducer according to claim 11, wherein the backfill material has a density ranging from 0.02-0.2 gm·

cm^-3.

16. An ultrasonic phased array transducer, comprising:

a piezoelectric ceramic material and a plurality of matching layers bonded to each other, the piezoelectric ceramic material and the plurality of matching layers having cuts therethrough to form an array of electrically and acoustically isolated individual elements;

a low density backfill material having an ultralow acoustic impedance deposited over the array of electrically and acoustically isolated individual elements, wherein the backfill material is an xerogel;

a plurality of interconnect vias formed in the backfill material, wherein the plurality of interconnect vias have a conducting material deposited therein.

17. An ultrasonic phased array transducer according to claim 16, wherein the backfill material has an acoustic impedance substantially less than 1 MRayl.

18. An ultrasonic phased array transducer according to claim 17, wherein the backfill material has an acoustic impedance less than 0.5 MRayl.

19. An ultrasonic phased array transducer according to claim 16, wherein the backfill material has a density ranging from 0.02-0.2 gm·

cm^-3.