Microelectronic package including a polymer encapsulated die

  • US 6,093,972 A
  • Filed: 05/03/1999
  • Issued: 07/25/2000
  • Est. Priority Date: 05/19/1997
  • Status: Expired due to Term
First Claim
Patent Images

1. A microelectronic package comprising:

  • a carrier substrate that includes a die attachment face and carrier sides about the die attachment face, said die attachment face comprising a die attach region and a surrounding region about the die attach region;

    an integrated circuit die overlying the die attach region and spaced apart therefrom by a gap, said integrated circuit die including an active face facing the die attach region and a back face opposite the active face;

    a plurality of solder bump interconnections that extend across the gap and connect the integrated circuit die to the die attach region; and

    an encapsulant formed of a singular polymeric body overlying the back face and molded against the surrounding region so as to encapsulate the die therein, said body comprising sides coextensive with said carrier sides.

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