Semiconductor device including a wire pattern for relaying connection between a semiconductor chip and leads
First Claim
1. A semiconductor device comprising:
- a plurality of semiconductor chips each having a plurality of electrode pads on an element forming surface;
a lead frame including a semiconductor chip mounting plate and a plurality of leads for electrically connecting signals to said electrode pads, at least two of said plurality of semiconductor chips being mounted onto both surfaces of said semiconductor chip mounting plate with their back surfaces opposing each other; and
a wire pattern having a certain pattern, said wire pattern being provided on at least one of the surfaces of said semiconductor chip mounting plate, wherein at least one pair of corresponding electrode pads of the semiconductor chips mounted onto both the surfaces is electrically connected to a common one of the plurality of leads, by electrically connecting at least one of the plurality of electrode pads of one of said plurality of semiconductor chips to one of the plurality of leads via said wire pattern, the one of said plurality of semiconductor chips being provided on the same surface as said wire pattern.
1 Assignment
0 Petitions
Accused Products
Abstract
An insulation material and a wire pattern are provided on at least one of the surfaces of a die pad. Wires of the wire pattern are patterned in such a manner that at least one inner lead included in at least one of two lead groups is electrically connected to an electrode pad provided on the element forming surface of the semiconductor chip near the side edge other than the side edge opposing the lead group including the above particular inner lead, while at least one inner lead included in the other lead group is electrically connected to an electrode pad provided on the element forming surface of the semiconductor chip near the side edge other than the side edge opposing the other lead group. Accordingly, a multichip-1-package semiconductor device using any kind of semiconductor chip can be realized. Also, the costs of the semiconductor device are saved and the semiconductor device can be developed in a shorter period by omitting the design modification of the semiconductor chip.
80 Citations
42 Claims
-
1. A semiconductor device comprising:
-
a plurality of semiconductor chips each having a plurality of electrode pads on an element forming surface; a lead frame including a semiconductor chip mounting plate and a plurality of leads for electrically connecting signals to said electrode pads, at least two of said plurality of semiconductor chips being mounted onto both surfaces of said semiconductor chip mounting plate with their back surfaces opposing each other; and a wire pattern having a certain pattern, said wire pattern being provided on at least one of the surfaces of said semiconductor chip mounting plate, wherein at least one pair of corresponding electrode pads of the semiconductor chips mounted onto both the surfaces is electrically connected to a common one of the plurality of leads, by electrically connecting at least one of the plurality of electrode pads of one of said plurality of semiconductor chips to one of the plurality of leads via said wire pattern, the one of said plurality of semiconductor chips being provided on the same surface as said wire pattern. - View Dependent Claims (2, 3, 4, 6, 8, 9, 10, 11, 12, 13, 16, 17, 18, 19, 23, 27, 28, 29, 30, 31, 32, 33)
-
-
5. A semiconductor device comprising:
-
a plurality of semiconductor chips each having a plurality of electrode pads on an element forming surface; a lead frame including a semiconductor chip mounting plate and a plurality of leads for electrically connecting signals to said electrode pads, at least two of said plurality of semiconductor chips being mounted onto both surfaces of said semiconductor chip mounting plate with their back surfaces opposing each other; and a wire pattern with a certain pattern provided for at least one of the semiconductor chips on at least one of the surfaces of said semiconductor chip mounting plate, such that wires on a side where electrode pads are formed can be connected to leads provided on another side. - View Dependent Claims (7, 14, 15, 20, 21, 22, 24, 25, 26, 34, 35, 36, 37, 38, 39, 40, 41, 42)
-
Specification