Optical sensor package and method of making same
First Claim
1. A package mountable on a support substrate, the package comprising:
- an image sensor;
a base substrate, the base substrate constructed of an insulating material, the image sensor carried on a surface of the base substrate;
a plurality of conductive strips on the base substrate extending toward the periphery of the base substrate, the integrated circuit optical sensor electrically connected to the conductive strips;
clips to clip onto the base substrate such that they hold onto the substrate, and to electrically connect to the conductive strips;
a window; and
a seal material, the window bonded to the surface of the base substrate in a spaced apart relationship by the seal material, the seal material extending from the window to the surface and providing a seal around the sensor, and wherein the image sensor is positioned between the window and the base substrate whereby the seal material, the window and the base substrate form a sealed cavity for the optical sensor and the window admits light to the optical sensor.
1 Assignment
0 Petitions
Accused Products
Abstract
A package that encapsulates an integrated circuit optical sensor and mounts on a support substrate includes a base substrate constructed of an insulating material. The optical sensor bottom surface is bonded to the base substrate top surface. Conductive strips on the base substrate top surface extend from a region near the optical sensor to an edge of the base substrate top surface. Wires are bonded on one end to a sensor bonding pad for which connection is desired and on the other end to a corresponding conductive strip. A window is bonded to the base substrate top surface in a spaced-apart relationship using seal material extending around the sensor enclosing each wire bond. Various means are provided for connecting each conductive strip to a corresponding trace on the support substrate. An electrochromic variable attenuator may be formed on the window, allowing control over the intensity of light striking the optical sensor.
465 Citations
4 Claims
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1. A package mountable on a support substrate, the package comprising:
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an image sensor; a base substrate, the base substrate constructed of an insulating material, the image sensor carried on a surface of the base substrate; a plurality of conductive strips on the base substrate extending toward the periphery of the base substrate, the integrated circuit optical sensor electrically connected to the conductive strips; clips to clip onto the base substrate such that they hold onto the substrate, and to electrically connect to the conductive strips; a window; and a seal material, the window bonded to the surface of the base substrate in a spaced apart relationship by the seal material, the seal material extending from the window to the surface and providing a seal around the sensor, and wherein the image sensor is positioned between the window and the base substrate whereby the seal material, the window and the base substrate form a sealed cavity for the optical sensor and the window admits light to the optical sensor. - View Dependent Claims (2, 3, 4)
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Specification
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- Resources
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Current AssigneeGentex Corporation
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Original AssigneeGentex Corporation
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InventorsStam, Joseph Scott, Bauer, Fred T.
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Primary Examiner(s)Monin, Jr., Donald L.
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Assistant Examiner(s)Wille, Douglas A.
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Application NumberUS09/137,909Time in Patent Office781 DaysField of Search257/432, 257/433, 257/434, 257/291, 257/215, 257/222, 257/680, 257/642, 257/696, 257/704, 361/387US Class Current257/222CPC Class CodesG01J 1/0204 Compact constructionG01J 1/0403 Mechanical elements; Suppor...G01J 1/24 using electric radiation de...G01J 2001/0276 ProtectionG02F 1/153 Constructional detailsH01L 2224/16225 the item being non-metallic...H01L 2224/48091 ArchedH01L 2224/48227 connecting the wire to a bo...H01L 2924/00014 the subject-matter covered ...H01L 31/0203 Containers; Encapsulations ...H04N 23/55 Optical parts specially ada...
