Semiconductor chip package with center contacts

CAFC
  • US 6,133,627 A
  • Filed: 12/03/1997
  • Issued: 10/17/2000
  • Est. Priority Date: 09/24/1990
  • Status: Expired due to Fees
First Claim
Patent Images

1. A semiconductor chip assembly comprising:

  • (a) a semiconductor chip having a front surface defining the top of the chip, said front surface including a central region and a peripheral region surrounding said central region, whereby said central region is disposed inwardly of said peripheral region, said chip having central contacts disposed in said central region of said front surface;

    (b) a dielectric element overlying said chip front surface, said dielectric element having a first surface facing toward said chip and a second surface facing away from said chip, said dielectric element having a hole encompassing said central contacts and an edge bounding said hole;

    (c) a plurality of terminals disposed on said dielectric element for interconnection to a substrate and overlying said chip front surface; and

    (d) a plurality of central contact leads extending between at least some of said central contacts and at least some of said terminals, each said central contact lead having a terminal end connected to one of said terminals and a contact end extending to one of said central contacts, said terminals being movable with respect to said central contacts so as to compensate for thermal expansion of said chip.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×