Air-cooled electronic apparatus

• US 6,137,682 A
• Filed: 01/11/1999
• Issued: 10/24/2000
• Est. Priority Date: 07/28/1998
• Status: Expired due to Fees

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Ishimine, Junichi, Suzuki, Masahiro
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Datskovsky, Michael
• Application Number:
  US09/227,964
• Time in Patent Office: 652 Days
• Field of Search: 361/676, 361/687, 361/694, 361/695, 361/699, 361/702, 361/700, 361/704, 361/705, 361/744, 361/701, 361/714, 361/719, 361/784, 361/785, 361/788, 361/717-718, 165/80.3, 165/80.4, 165/104.33, 165/185, 165/104.34, 165/104.26, 165/104.21, 62/259.2, 29/741, 29/740, 29/890.032, 29/842, 257/713, 257/718, 257/706-727, 174/15.2, 174/16.3, 174/252
• US Class Current: 361/704
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid

Abstract

An electronic apparatus includes a circuit board, a connector provided on the circuit board, an integrated circuit module attached to the connector, and a heat sink attached to the integrated circuit module. A heat transfer device is disposed at a position separate from the heat sink and arranged in a cooling air passageway. A heat conduction path thermally connects the heat sink with the heat transfer device. Since the heat transfer device can be arranged outside the frame of the apparatus, the heat transfer device can be constructed to have a sufficient cooling capacity, while the integrated circuit module and the heat sink can be constructed in a relatively compact design.

Claims

1. An electronic apparatus comprising:

a circuit board;

a connector provided on the circuit board;

an integrated circuit module attached to the connector;

a heat sink attached to the integrated circuit module;

heat transfer means disposed at a position separate from the heat sink and arranged in a cooling air passageway for transferring heat, wherein the connector the integrated circuit module and the heat sink are arranged on one side of the circuit board, and the heat transfer means is arranged on the other side of the circuit board; and

a heat conduction path for thermally connecting the heat sink to the heat transfer means.

2. An electronic apparatus as defined by claim 1, wherein the heat conduction path comprises a heat pipe.

3. An electronic apparatus as defined by claim 1, wherein the heat sink has a first thermal terminal, and the heat conduction path has a second thermal terminal capable of being thermally brought into contact with the first thermal terminal.

4. An electronic apparatus as defined by claim 3, wherein the second thermal terminal, the heat conduction path and the heat transfer means form an integral heat transfer unit, and the heat transfer unit is attached to a frame via a heat transfer unit mounting means which has a degree of freedom of movement in three dimensions.

5. An electronic apparatus as defined by claim 4, wherein the heat transfer unit includes a duct forming the cooling air passageway, and an elastic unit member is provided between the heat transfer means and the duct or the frame for biasing the heat transfer means so that the first thermal terminal is brought into contact with the second thermal terminal.

6. An electronic apparatus as defined by claim 3, wherein the first thermal terminal and the second thermal terminal are mechanically coupled with each other.

7. An electronic apparatus as defined by claim 1, wherein a circuit element other than the integrated circuit module is mounted to the surface of the circuit board on the opposite side from that carrying the connector for mounting the integrated circuit module.

8. An electronic apparatus as defined by claim 1, wherein a circuit element other than the integrated circuit module is mounted to the surface of the circuit board on the side carrying the connector for mounting the integrated circuit module, the circuit element having a heat sink for the circuit element, the heat sink for the circuit element being thermally connected to the heat transfer means via the heat conduction path.

9. An electronic apparatus as defined by claim 4, wherein the heat transfer means is a device separated from the electronic apparatus carrying the integrated circuit module.

10. An electronic apparatus as defined by claim 3, wherein an introduction part of the second thermal terminal is tapered and made of an elastic material.

11. An electronic apparatus as defined by claim 4, wherein a plurality of electronic equipments are connected to the single heat transfer unit.