Controlled cleavage process and resulting device using beta annealing

  • US 6,162,705 A
  • Filed: 02/19/1998
  • Issued: 12/19/2000
  • Est. Priority Date: 05/12/1997
  • Status: Expired due to Term
First Claim
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1. A process for forming a film of material from a substrate, said process comprising steps of:

  • introducing particles through a surface of a substrate to a selected depth underneath said surface, said particles being at a concentration at said selected depth to define a substrate material to be removed above said selected depth;

    increasing a built-in energy state of said substrate at said selected depth using an energy source;

    applying energy to at least a first region of said substrate, to initiate a controlled cleaving action at said selected depth in said substrate, said first region being less than the entirety of said substrate.whereupon said cleaving action is made using a propagating cleave front to free a portion of said material to be removed from said substrate.

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