Method of manufacturing and testing an electronic device, and an electronic device
First Claim
1. A method of manufacturing and testing an electronic circuit, the method comprising:
- forming a plurality of conductive traces on a substrate and providing a gap in one of the conductive traces;
attaching a circuit component to the substrate and coupling the circuit component to at least one of the conductive traces;
supporting a battery on the substrate, and coupling the battery to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap;
verifying electrical connections by performing an in circuit test, after the circuit component is attached and the battery is supported; and
employing a jumper to electrically close the gap, and complete the circuit, after verifying electrical connections.
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0 Petitions
Accused Products
Abstract
A method of manufacturing and testing an electronic circuit, the method comprising forming a plurality of conductive traces on a substrate and providing a gap in one of the conductive traces; attaching a circuit component to the substrate and coupling the circuit component to at least one of the conductive traces; supporting a battery on the substrate, and coupling the battery to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap; verifying electrical connections by performing an in circuit test, after the circuit component is attached and the battery is supported; and employing a jumper to electrically close the gap, and complete the circuit, after verifying electrical connections. An electronic circuit comprising a substrate; a plurality of conductive traces on the substrate, with a gap in one of the conductive traces; a circuit component attached to the substrate and coupled to at least one of the conductive traces; a battery supported on the substrate and coupled to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap; and a jumper electrically closing the gap and completing the circuit, the jumper comprising conductive epoxy.
408 Citations
21 Claims
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1. A method of manufacturing and testing an electronic circuit, the method comprising:
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forming a plurality of conductive traces on a substrate and providing a gap in one of the conductive traces;
attaching a circuit component to the substrate and coupling the circuit component to at least one of the conductive traces;
supporting a battery on the substrate, and coupling the battery to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap;
verifying electrical connections by performing an in circuit test, after the circuit component is attached and the battery is supported; and
employing a jumper to electrically close the gap, and complete the circuit, after verifying electrical connections. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of manufacturing and testing an electronic circuit, the method comprising:
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forming first and second traces on a substrate such that the first trace has a first portion and the second trace has a second portion spaced apart from the first portion;
attaching a circuit component to the substrate and coupling the circuit component to at least one of the conductive traces;
supporting a battery on the substrate, and coupling the battery to at least one of the conductive traces, wherein a complete circuit would be defined including the traces, circuit component, and battery, if the first portion was coupled to the second portion;
verifying electrical connections between the traces and the circuit component, and between the traces and the battery, after the circuit component is attached and the battery is supported; and
coupling the first portion to the second portion to complete the circuit after verifying electrical connections. - View Dependent Claims (9, 10, 11, 12)
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13. A method of manufacturing and testing an electronic circuit, the method comprising:
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forming first and second traces on a substrate such that the first trace has a first portion and the second trace has a second portion spaced apart from the first portion;
attaching a circuit component to the substrate and coupling the circuit component to at least one of the conductive traces;
supporting a battery on the substrate, and coupling the battery to at least one of the conductive traces, wherein a completed circuit would be defined including the traces, circuit component, and battery, if the first portion was coupled to the second portion;
verifying electrical connections by performing an in circuit test, after the circuit component is attached and the battery is supported; and
coupling the first portion to the second portion using conductive epoxy to complete the circuit after verifying electrical connections. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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20. A method of manufacturing and testing an electronic circuit, the method comprising:
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forming first and second traces on a substrate such that the first trace has a first portion and the second trace has a second portion spaced apart from the first portion;
attaching an integrated circuit to the substrate and coupling the integrated circuit to at least one of the conductive traces the integrated circuit defining a wireless identification device and including a receiver, a modulator, a microprocessor and a memory;
both supporting a battery on the substrate and coupling the battery to at least one of the conductive traces using conductive epoxy, wherein a completed circuit would be defined including the traces, circuit component, and battery, if the first portion was coupled to the second portion;
verifying electrical connections by performing an in circuit test, after the circuit component is attached and the battery is supported; and
coupling the first portion to the second portion using conductive epoxy to complete the circuit after verifying electrical connections. - View Dependent Claims (21)
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Specification