Method of manufacturing and testing an electronic device, and an electronic device

• US 6,167,614 B1
• Filed: 09/08/1999
• Issued: 01/02/2001
• Est. Priority Date: 10/20/1997
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Tuttle, Mark E., Lake, Rickie C., Medlen, Curtis M.
• Primary Examiner(s): Arbes, Carl J.
• Time in patent office: 482 Days
• Field of Search: 298/32, 298/40, 295/93, 297/40, 295/64, 296/231, 296/235, 429/90
• US Class Current: 29/832
• CPC Class Codes: G01R 31/70 Testing of connections between components and printed circuit boards G01R31/68 takes precedence
• CPC Class Codes: H05K 1/0268 for electrical inspection or testing
• CPC Class Codes: H05K 1/0293 Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
• CPC Class Codes: H05K 2201/10037 Printed or non-printed battery
• CPC Class Codes: H05K 2203/173 Adding connections between adjacent pads or conductors, e.g. for modifying or repairing programmable, customizable or modifiable circuits H05K1/0286
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49108 Electric battery cell making
• CPC Class Codes: Y10T 29/49115 including coating or impregnating
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A method of manufacturing and testing an electronic circuit, the method comprising forming a plurality of conductive traces on a substrate and providing a gap in one of the conductive traces; attaching a circuit component to the substrate and coupling the circuit component to at least one of the conductive traces; supporting a battery on the substrate, and coupling the battery to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap; verifying electrical connections by performing an in circuit test, after the circuit component is attached and the battery is supported; and employing a jumper to electrically close the gap, and complete the circuit, after verifying electrical connections. An electronic circuit comprising a substrate; a plurality of conductive traces on the substrate, with a gap in one of the conductive traces; a circuit component attached to the substrate and coupled to at least one of the conductive traces; a battery supported on the substrate and coupled to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap; and a jumper electrically closing the gap and completing the circuit, the jumper comprising conductive epoxy.

Claims

1. A method of manufacturing and testing an electronic circuit, the method comprising:

forming a plurality of conductive traces on a substrate and providing a gap in one of the conductive traces;

attaching a circuit component to the substrate and coupling the circuit component to at least one of the conductive traces;

supporting a battery on the substrate, and coupling the battery to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap;

verifying electrical connections by performing an in circuit test, after the circuit component is attached and the battery is supported; and

employing a jumper to electrically close the gap, and complete the circuit, after verifying electrical connections.

2. A method of manufacturing and testing an electronic circuit in accordance with claim 1 wherein employing a jumper comprises employing conductive epoxy.

3. A method of manufacturing and testing an electronic circuit in accordance with claim 1 wherein employing a jumper comprises dispensing conductive epoxy over the gap.

4. A method of manufacturing and testing an electronic circuit in accordance with claim 3 wherein employing a jumper comprises dispensing conductive epoxy having a resistance of less than 1000 ohms within 500 milliseconds of being dispensed.

5. A method of manufacturing and testing an electronic circuit in accordance with claim 1 wherein employing a jumper comprises placing a conductor across the gap and coupling the conductor to traces on either side of the gap with conductive epoxy.

6. A method of manufacturing and testing an electronic circuit in accordance with claim 1 wherein employing a jumper comprises placing a resistor across the gap and coupling the resistor to traces on either side of the gap with conductive epoxy.

7. A method of manufacturing and testing an electronic circuit in accordance with claim 1 wherein the size of the gap is approximately 30 mils.

8. A method of manufacturing and testing an electronic circuit, the method comprising:

forming first and second traces on a substrate such that the first trace has a first portion and the second trace has a second portion spaced apart from the first portion;

attaching a circuit component to the substrate and coupling the circuit component to at least one of the conductive traces;

supporting a battery on the substrate, and coupling the battery to at least one of the conductive traces, wherein a complete circuit would be defined including the traces, circuit component, and battery, if the first portion was coupled to the second portion;

verifying electrical connections between the traces and the circuit component, and between the traces and the battery, after the circuit component is attached and the battery is supported; and

coupling the first portion to the second portion to complete the circuit after verifying electrical connections.

9. A method of manufacturing and testing an electronic circuit in accordance with claim 8 wherein the battery is mechanically supported from the substrate by epoxy.

10. A method of manufacturing and testing an electronic circuit in accordance with claim 8 wherein the battery is electrically coupled to at least one of the traces by conductive epoxy.

11. A method of manufacturing and testing an electronic circuit in accordance with claim 8 wherein the distance between the first and second portions is equal to or less than 30 mils.

12. A method of manufacturing and testing an electronic circuit in accordance with claim 8 wherein attaching a circuit component to the substrate comprises attaching an integrated circuit to the substrate.

13. A method of manufacturing and testing an electronic circuit, the method comprising:

forming first and second traces on a substrate such that the first trace has a first portion and the second trace has a second portion spaced apart from the first portion;

attaching a circuit component to the substrate and coupling the circuit component to at least one of the conductive traces;

supporting a battery on the substrate, and coupling the battery to at least one of the conductive traces, wherein a completed circuit would be defined including the traces, circuit component, and battery, if the first portion was coupled to the second portion;

verifying electrical connections by performing an in circuit test, after the circuit component is attached and the battery is supported; and

coupling the first portion to the second portion using conductive epoxy to complete the circuit after verifying electrical connections.

14. A method of manufacturing and testing an electronic circuit in accordance with claim 13 wherein the first portion is spaced apart from the second portion by a distance that is sufficiently small so as to be capable of being bridged by a drop of conductive epoxy.

15. A method of manufacturing and testing an electronic circuit in accordance with claim 13 wherein the first portion is spaced apart from the second portion by a distance that is sufficiently small so as to be capable of being bridged by a drop of conductive epoxy, and wherein coupling the first portion to the second portion comprises dispensing a drop of conductive epoxy to bridge the distance from the first portion to the second portion.

16. A method of manufacturing and testing an electronic circuit in accordance with claim 13 wherein the first portion is spaced apart from the second portion by a distance that is sufficiently small so as to be capable of being bridged by a drop of conductive epoxy having a resistance of less than 1000 ohms within 500 milliseconds of being dispensed.

17. A method of manufacturing and testing an electronic circuit in accordance with claim 13 wherein coupling the first portion to the second portion comprises placing conductive epoxy on the first and second portions and placing a conductor between the conductive epoxy on the first and second portions.

18. A method of manufacturing and testing an electronic circuit in accordance with claim 13 wherein coupling the first portion to the second portion comprises placing conductive epoxy on the first and second portions and placing a resistor between the conductive epoxy on the first and second portions.

19. A method of manufacturing and testing an electronic circuit in accordance with claim 13 wherein the battery is mechanically coupled to the substrate by epoxy.

20. A method of manufacturing and testing an electronic circuit, the method comprising:

forming first and second traces on a substrate such that the first trace has a first portion and the second trace has a second portion spaced apart from the first portion;

attaching an integrated circuit to the substrate and coupling the integrated circuit to at least one of the conductive traces the integrated circuit defining a wireless identification device and including a receiver, a modulator, a microprocessor and a memory;

both supporting a battery on the substrate and coupling the battery to at least one of the conductive traces using conductive epoxy, wherein a completed circuit would be defined including the traces, circuit component, and battery, if the first portion was coupled to the second portion;

verifying electrical connections by performing an in circuit test, after the circuit component is attached and the battery is supported; and

coupling the first portion to the second portion using conductive epoxy to complete the circuit after verifying electrical connections.

21. A method of manufacturing and testing an electronic circuit in accordance with claim 20 wherein the first and second portions are spaced apart by approximately 30 mils.