Infrared transceiver module and method for making same

• US 6,169,295 B1
• Filed: 05/29/1998
• Issued: 01/02/2001
• Est. Priority Date: 05/29/1998
• Status: Expired due to Fees

• Current Assignee: Maxim Integrated Products, Inc. (Analog Devices, Inc.)
• Original Assignee: Maxim Integrated Products, Inc. (Analog Devices, Inc.)
• Inventors: Koo, Ronald B.
• Primary Examiner(s): MINTEL, WILLIAM A
• Application Number:
  US09/087,384
• Time in Patent Office: 949 Days
• Field of Search: 257/80, 257/81, 257/82, 257/84, 257/85, 257/98, 257/99, 257/100, 257/432, 257/433, 257/434, 438/25, 438/26, 438/27, 438/28, 438/29
• US Class Current: 257/81
• CPC Class Codes: H01L 31/167 the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers

Abstract

An IR transceiver module includes a lead frame, a sensor, an emitter, and a body encapsulating the sensor and emitter, where the body has an integrally formed lens aligned with both the sensor and with the emitter. The sensor is supported proximate to a support surface of the lead frame and has a sensing area which is generally parallel to the support surface. The emitter is supported proximate to the sensor and within a vertical projection of the sensing area, i.e. it is vertically aligned with the sensor. In embodiments of the invention, a recess is formed into the sensing surface of the sensor that is provided with a reflective material to form a reflective cup for the emitter. In other embodiments, a transceiver is also supported proximate to the lead frame and is electrically coupled to both the sensor and the emitter. By providing a module having both the emitter and sensor aligned with a single lens, a very small form factor can be achieved.

Claims

1. An IR transceiver module comprising:

a lead frame having a support surface;

a sensor supported proximate said support surface, wherein said sensor is provided with a recess, and wherein said emitter is mounted within said recess;

an emitter supported proximate to said sensor and within a vertical projection of said sensing area of said sensor wherein said emitter is mounted within said sensing area of said sensor;

further comprising a transceiver supported proximate to said support surface and electrically coupled to both said sensor and said emitter, wherein said transceiver is mounted on said support surface; and

a body encapsulating said sensor and said emitter, said body having an integral lens aligned with both said sensing area of said sensor and with said emitter.

2. An IR transceiver module as recited in claim 1 wherein said recess is provided with an IR reflective coating.

3. An IR transceiver module as recited in claim 2 wherein said reflective coating includes an elemental metal or an alloy thereof.

4. An IR transceiver module as recited in claim 3 wherein said elemental metal is selected from the group including aluminum, copper, silver, gold, tungsten, and titanium.

5. An IR transceiver module as recited in claim 1 wherein said recess extends fully through said sensor to said transceiver.

6. An IR transceiver module comprising:

a lead frame having a support surface;

a sensor supported proximate said support surface wherein said sensor is formed integrally with said transceiver, wherein said sensor is provided with a recess, and wherein said emitter is mounted within said recess;

an emitter supported proximate to said sensor and within a vertical projection of said sensing area of said sensor, wherein said emitter is mounted within the sensing area of said sensor; and

a body encapsulating said sensor and said emitter, said body having an integral lens aligned with both said sensing area of said sensor and with said emitter.

7. An IR transceiver module as recited in claim 6 wherein said recess is provided with an IR reflective coating.

8. An IR transceiver module as recited in claim 7 wherein said reflective coating includes an elemental metal or an alloy thereof.

9. An IR transceiver module as recited in claim 8 wherein said elemental metal is selected from the group including aluminum, copper, silver, gold, tungsten, and titanium.

10. An IR transceiver module as recited in claim 6 wherein said recess extends fully through said sensor to said support surface.

11. An IR transceiver module comprising:

a lead frame having a support surface;

a sensor supported proximate said support surface, wherein said sensor is mounted on said support surface, wherein said sensor is provided with a recess, and wherein said emitter is mounted within said recess;

emitter supported proximate to said sensor and within a vertical projection of said sensing area of said sensor, wherein said emitter is mounted within said sensing area of said sensor; and

a body encapsulating said sensor and said emitter, said body having an integral lens aligned with both said sensing area of said sensor and with said emitter.

12. An IR transceiver module as recited in claim 11 wherein said recess is provided with an IR reflective coating.

13. An IR transceiver module as recited in claim 12 wherein said reflective coating includes one of an elemental metal or an alloy thereof.

14. An IR transceiver module as recited in claim 13 wherein said elemental metal is selected from the group including aluminum, copper, silver, gold, tungsten, and titanium.

15. An IR transceiver module as recited in claim 11 wherein said recess extends fully through said sensor to said support surface.

16. A method for making an IR transceiver module comprising:

providing a lead frame;

coupling a sensor to said lead frame, said sensor having a sensing area;

disposing an emitter within said sensing area of said sensor;

encapsulating said sensor and emitter within a plastic body provided with an integral lens aligned with both said sensor and said emitter;

forming a recess within said sensor that is receptive to said emitter; and

providing an IR reflective coating within said recess.

17. A method for making an IR transceiver module comprising:

providing a lead frame;

coupling a sensor to said lead frame, said sensor having a sensing area;

disposing an emitter within said sensing area of said sensor;

encapsulating said sensor and emitter within a plastic body provided with an integral lens aligned with both said sensor and said emitter;

coupling said sensor to said lead frame with a transceiver;

forming a recess within said sensor that is receptive to said emitter; and

providing an IR reflective coating within said recess.

18. A method for making an IR transceiver module as recited in claim 17 further comprising:

forming a recess within said sensor that is receptive to said emitter; and

providing an IR reflective coating within said recess.