Memory card of the contactless type

• US 6,173,898 B1
• Filed: 05/11/1999
• Issued: 01/16/2001
• Est. Priority Date: 05/11/1998
• Status: Expired due to Fees

• Current Assignee: Axalto S A
• Original Assignee: SCHLUMBERGER SYSTEMES
• Inventors: Mande, Mickaël
• Primary Examiner(s): Le, Thien M.
• Assistant Examiner(s): Lee, Diane I.
• Application Number:
  US09/309,771
• Time in Patent Office: 616 Days
• Field of Search: 235/488, 235/487, 235/492, 257/678, 257/679, 257/690
• US Class Current: 235/488
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers

Abstract

A memory card of the contactless type having a laminated card body of plastic material including a support sheet carrying a coupling antenna and an integrated circuit connected to the antenna. The integrated circuit has two contact pads resting directly on two conductive areas connected to the coupling antenna, and also rests on two compensation areas that are not connected. The integrated circuit and the support sheet are also associated mechanically with each other by an adhesive material disposed in the empty space defined by their respective facing faces.

Claims

1. A contactless memory card, comprising a laminated card body of plastic material including a sandwiched support sheet having on one surface thereof a coupling antenna and integrated circuit with two contact pads connected to said coupling antenna, wherein the integrated circuit rests via said two contact pads directly on two conductive areas connected to the coupling antenna, and also rests on a least one additional compensation area that is not connected to said antenna, so that the integrated circuit lies substantially parallel to the support sheet, said integrated circuit and the support sheet being mechanically associated with each other by an adhesive material located in an empty space defined by respective facing surfaces of the integrated circuit and the support sheet.

2. A memory card according to claim 1, wherein two said conductive areas connected to the coupling antenna and two said compensation areas non-connected to the coupling antenna are provided occupying two diagonals of a rectangle to enable the integrated circuit to be supported directly via four corners of the integrated circuit.

3. A memory card according to claim 2, wherein turns of the coupling antenna pass between pairs of adjacent ones of said areas by extending under the integrated circuit.

4. A method of manufacturing a memory card according to claim 2, wherein prior to laminating the card body the following successive steps are performed:

a) said coupling antenna, said two conductive areas connected to said coupling antenna, and said two non-connected compensation areas are formed on one face of the insulating support sheet by etching or by printing, said areas being positioned in a rectangle corresponding to a shape of the integrated circuit to be put into place; and

b) the integrated circuit is put into place so that two of its pads bear directly on the conductive areas and an adhesive material is interposed in the empty space defined by the facing faces of the support sheet and of the integrated circuit.

5. A method according to claim 4, wherein the adhesive material is interposed firstly by forming one or two spots of adhesive to provide a mechanical link between the support sheet and the integrated circuit, and then depositing at least one drop of sealing resin in the fluid state on the support sheet in the vicinity of the integrated circuit, said drop extending by capillarity into the empty space defined by the respective facing faces.

6. A method according to claim 5, for manufacturing a memory card according to claim 7, wherein a drop of sealing resin is deposited in the areas defined by the concave sides of arcs formed by portions of the turns of the coupling antenna.

7. A memory card according to claim 1, wherein the adhesive material comprises at least one spot of adhesive, and a sealing resin occupies a majority of the empty space defined by the respective facing faces of the support sheet and of the integrated circuit.

8. A memory card according to claim 7, wherein turns of the coupling antenna pass between pairs of adjacent areas by extending under the integrated circuit, and wherein at least one of the turns of the coupling antenna passing beneath the integrated circuit presents an external portion extending out from under said integrated circuit.

9. A memory card according to claim 8, wherein two turns of the coupling antenna present profiles that correspond in axial symmetry about a center substantially in registration with the center of the integrated circuit.

10. A memory card according to claim 9, wherein the external portions of the two turns form two arcs whose concave sides face toward the center of symmetry.

11. A memory card according to claim 8, wherein the non-connected compensation areas present respective retaining appendices extending toward an adjacent turn of the coupling antenna passing beneath the integrated circuit.