Lead-free solders

CAFC
  • US 6,176,947 B1
  • Filed: 10/12/1999
  • Issued: 01/23/2001
  • Est. Priority Date: 12/31/1998
  • Status: Expired due to Term
First Claim
Patent Images

1. A lead-free solder alloy consisting essentially of 76% to 96% Sn, 0.2% to 2.5% Cu, 2.5% to 4.5% Ag and 6% to 12% In having a liquidus melting temperature below about 215°

  • C.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×