Multi-layer organic land grid array to minimize via inductance

  • US 6,177,732 B1
  • Filed: 05/27/1999
  • Issued: 01/23/2001
  • Est. Priority Date: 05/27/1999
  • Status: Expired due to Fees
First Claim
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1. A method to minimize inductance in a multi-layer organic land grid array (OLGA) packaging, the method comprising:

  • staggering a plurality of layers vertically, the plurality of layers including first and second layers, the first and second layers having first and second metal strip connections, respectively, the second layer being above the first layer; and

    aligning the first metal strip connection with the second metal strip connection to maximize mutual inductance between the first and second layers.

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