×

Process for forming cone shaped solder for chip interconnection

  • US 6,184,062 B1
  • Filed: 01/19/1999
  • Issued: 02/06/2001
  • Est. Priority Date: 01/19/1999
  • Status: Expired due to Term
First Claim
Patent Images

1. A process for forming non-spherical shapes in solder interconnects on the surface of a substrate or a semiconductor die comprising the steps of:

  • a)depositing a first layer of solder onto a surface;

    b)plating a second layer of solder over said first layer of solder; and

    c)forming said first and second layers of solder into a non-spherical shape wherein the non-spherical shape of said solder interconnects facilitate joining between two surfaces.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×