Optical semiconductor device
DCFirst Claim
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1. An optical semiconductor device comprising:
- an n-layer having n-conduction type;
a p-layer having p-conduction type formed above said n-layer;
an electrode formed uniformly on substantially the entire surface of said p-layer and capable of passing light therethrough;
an electrode pad for wire bonding located on a portion of said electrode; and
a highly resistive region formed in a part of said p-layer below said electrode pad, wherein said n-layer and said p-layer are made of a nitride compound semiconductor including at least one of aluminum (Al), gallium (Ga), and indium (In), said p-layer is a layer whose resistivity is lowered by annealing or electron beam irradiation said p-layer having an unchanged kind of impurity and an unchanged density of impurity, said highly resistive region is formed by said annealing or electron beam irradiation without lowering the resistivity.
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Abstract
A LED has a thin highly resistive or insulative layer formed below an electrode pad in order to divert current flow from the region below an electrode pad, which region does not contribute to light emission, to another region which does. Consequently, better current efficiency is obtained. Further, diverting current flow from the region below the electrode pad where mechanical damages are expected deters deterioration of the region. Consequently, the LED lasts longer and is a better quality product.
21 Citations
9 Claims
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1. An optical semiconductor device comprising:
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an n-layer having n-conduction type;
a p-layer having p-conduction type formed above said n-layer;
an electrode formed uniformly on substantially the entire surface of said p-layer and capable of passing light therethrough;
an electrode pad for wire bonding located on a portion of said electrode; and
a highly resistive region formed in a part of said p-layer below said electrode pad, wherein said n-layer and said p-layer are made of a nitride compound semiconductor including at least one of aluminum (Al), gallium (Ga), and indium (In), said p-layer is a layer whose resistivity is lowered by annealing or electron beam irradiation said p-layer having an unchanged kind of impurity and an unchanged density of impurity, said highly resistive region is formed by said annealing or electron beam irradiation without lowering the resistivity. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An optical semiconductor device comprising:
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an n-layer having n-conduction type;
a p-layer having p-conduction type formed above said n-layer;
an electrode formed on said p-layer and capable of passing light therethrough;
an electrode pad for wire bonding located on a portion of said electrode;
a highly resistive region located below said electrode pad and having a lateral periphery substantially corresponding in size and shape to a lateral periphery of said electrode pad, wherein said highly resistive region comprises a silicon oxide (SiO2) layer. - View Dependent Claims (9)
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Specification