Lateral IGBT in an SOI configuration and method for its fabrication

• US 6,191,456 B1
• Filed: 06/28/1999
• Issued: 02/20/2001
• Est. Priority Date: 06/26/1998
• Status: Expired due to Term

• Current Assignee: Infineon Technologies AG
• Original Assignee: Siemens AG
• Inventors: Stoisiek, Michael, Vietzke, Dirk
• Primary Examiner(s): Meier, Stephen D.
• Application Number:
  US09/344,927
• Time in Patent Office: 603 Days
• Field of Search: 257/368, 257/355, 257/409
• US Class Current: 257/368
• CPC Class Codes: H01L 29/7394 on an insulating layer or substrate, e.g. thin film device or device isolated from the bulk substrate H01L29/7398 takes precedence

Abstract

A lateral IGBT in an SOI configuration having a top side and an underside is proposed. The lateral IGBT has a drain zone extending to the top side and is of a first conductivity type. The underside of the LIGBT forms a substrate of a second conductivity type. A lateral insulation layer is situated between the substrate and the drain zone. At least one laterally formed region of the second conductivity type is situated in the drain zone, in the vicinity of the lateral insulation layer. These laterally formed regions being spaced apart from one another lying in one plane.

Claims

1. A lateral insulated gate bipolar transistor (IGBT) in a silicon on insulator (SOI) configuration having a top side and an underside, comprising:

a drain zone of a first conductivity type extending to the top side;

an anode zone of a second conductivity type incorporated in said drain zone and extending to the top side;

a base zone of the second conductivity type incorporated in said drain zone and extending to the top side;

a source zone of the first conductivity type incorporated in said base zone and extending to the top side;

a substrate of the second conductivity type forming the underside;

a source electrode disposed in contact with said source zone and said base zone;

a drain electrode disposed in contact with said anode zone;

a gate insulating layer disposed on the top side between said source zone and said anode zone;

a gate electrode disposed on said gate insulating layer;

a lateral insulation layer disposed between said drain zone and said substrate; and

at least one laterally formed region of the second conductivity type disposed in said drain zone in a vicinity of said lateral insulation layer.

2. The lateral IGBT according to claim 1, including an insulation region in a form of a trench, said insulation region extending from the top side to as far as said lateral insulating layer and forms a vertical extending boundary.

3. The lateral IGBT according to claim 1, including a drain extension of the first conductivity type adjoining the top side, said anode zone lying in said drain extension.

4. The lateral IGBT according to claim 3, including a field plate disposed on said gate insulating layer and covering said drain extension.

5. The lateral IGBT according to claim 1, wherein said substrate is at a fixed potential.

6. The lateral IGBT according to claim 2, including a vertically running region of the second conductivity type abutting said insulation region.

7. The lateral IGBT according to claim 2, wherein said insulation region is at a lowest potential.

8. The lateral IGBT according to claim 1, wherein said drain zone, said anode zone, said base zone, said source zone, said substrate, said source electrode, said drain electrode, said gate insulating layer, said gate electrode, said lateral insulation layer, and said at least one laterally formed region define an overall structure that is mirror-symmetrical in a lateral orientation.

9. The lateral IGBT according to claim 1, wherein said at least one laterally formed region is a plurality of laterally formed regions each having a polygonal form and are spaced apart at substantially equal distances from one another and lying in one plane.

10. The lateral IGBT according to claim 1, wherein said at least one laterally formed region is a plurality of laterally formed regions having a form adapted to a circumference, and are spaced apart at substantially equal distances from one another and lying in one plane.

11. The lateral IGBT according to claim 1, wherein said at least one laterally formed region is a plurality of laterally formed regions that adjoin said lateral insulation layer.

12. The lateral IGBT according to claim 6, wherein said at least one laterally formed region is a plurality of laterally formed regions and said drain zone has an edge, said laterally formed regions lying nearest said edge of said drain zone are in contact with said vertically running region of the second conductivity type.

13. The lateral IGBT according to claim 1, wherein said drain zone, said anode zone, said base zone, said source zone, said substrate, said source electrode, said drain electrode, said gate insulating layer, said gate electrode, said lateral insulation layer, and said at least one laterally formed region define an overall structure having a lateral form that is one of round shaped and finger shaped.

14. The lateral IGBT according to claim 1, wherein said lateral insulating layer is composed of SiO₂.

15. The lateral IGBT according to claim 2, wherein said insulating region is composed of SiO₂.

16. The lateral IGBT according to claim 1, wherein said at least one laterally formed region has a charge carrier density between 1*10¹⁷ and 1*10¹⁹.