Apparatus including a heat-dissipating apparatus, and method for forming same

• US 6,202,739 B1
• Filed: 11/25/1998
• Issued: 03/20/2001
• Est. Priority Date: 11/25/1998
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Pal, Debabrata, McDunn, Kevin
• Primary Examiner(s): Lazarus, Ira S.
• Assistant Examiner(s): DUONG, THO V
• Application Number:
  US09/200,410
• Time in Patent Office: 846 Days
• Field of Search: 165/10, 165/104.21, 165/104.33, 165/185, 361/700, 361/687
• US Class Current: 165/104.33
• CPC Class Codes: H01L 23/4275 by melting or evaporation of solids
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The present invention provides an apparatus (200) that includes a heat-generating component (202) and a heat-dissipating apparatus (120). The heat-generating component (202) is mounted on a substrate (204). The heat-dissipating apparatus (120) includes a housing piece (100) that includes a sealed chamber (102) and a phase change material (106) disposed within the sealed chamber (102). The heat-dissipating apparatus (120) is thermally coupled to the heat-generating component (202) and provides for heat dissipation by an endothermic process of changing phase from solid to liquid, thereby lowering the operating temperature of the heat-generating component (202).

Claims

1. A method for forming a heat-dissipating apparatus, the method comprising the steps of:

providing a housing piece with a cavity therein;

dispensing a phase change material into the cavity;

placing a lid piece on the housing piece, the lid piece formed of a conformable material and enclosing the phase change material within the cavity;

sealing the cavity by attaching the lid piece to the housing piece; and

impressing a heat-generating electronic component in a recess of the lid piece such that the heat-generating electronic component is at least partial surrounded by the phase change material and is thermally-coupled to the phase change material by the lid piece.

2. A method for forming a heat-dissipating apparatus in accordance with claim 1, wherein the phase change material is in a liquid phase when the lid piece is impressed by the heat-generating electronic component and solidifies thereafter.