Method and apparatus for placing conductive preforms

  • US 6,202,918 B1
  • Filed: 01/28/1997
  • Issued: 03/20/2001
  • Est. Priority Date: 01/28/1997
  • Status: Expired due to Term
First Claim
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1. A method for placing a plurality of conductive preforms on a plurality of electronic pads, the method comprising the steps of:

  • holding a plurality of conductive preforms at least partially within a plurality of openings in a foil wherein the openings have at least one exposed diameter that is equal to or larger then the diameter of the conductive preforms by providing a holding force to the plurality of conductive preforms;

    locating the plurality of conductive preforms at a plurality of electronic pads; and

    placing the plurality of conductive preforms on the plurality of electronic pads by removing the holding.force from the plurality of conductive preforms.

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