Chip carrier to allow electron beam probing and fib modifications

  • US 6,229,319 B1
  • Filed: 11/12/1998
  • Issued: 05/08/2001
  • Est. Priority Date: 03/22/1996
  • Status: Expired due to Fees
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First Claim
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1. A die carrier for allowing probing of an active region of a die including peripheral input/output bump pads located about the periphery of the active region, the die carrier comprising:

  • a membrane having a probe access region for making substantially all of the die'"'"'s active region accessible to a probe, a plurality of peripheral bump contacts adjacent to the probe access region and arranged to make electrical contact with the peripheral bump pads of the die, and a plurality of socket contacts electrically connected to said peripheral bump contacts; and

    a membrane carrier supporting said membrane and having an opening corresponding, at least in part, to the location of said probe access region of the membrane, wherein the die carrier, including the opening in the membrane carrier together with the probe access region of the membrane, allows probe beam radiation to directly probe the die'"'"'s active region.

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