Chip carrier to allow electron beam probing and fib modifications
First Claim
1. A die carrier for allowing probing of an active region of a die including peripheral input/output bump pads located about the periphery of the active region, the die carrier comprising:
- a membrane having a probe access region for making substantially all of the die'"'"'s active region accessible to a probe, a plurality of peripheral bump contacts adjacent to the probe access region and arranged to make electrical contact with the peripheral bump pads of the die, and a plurality of socket contacts electrically connected to said peripheral bump contacts; and
a membrane carrier supporting said membrane and having an opening corresponding, at least in part, to the location of said probe access region of the membrane, wherein the die carrier, including the opening in the membrane carrier together with the probe access region of the membrane, allows probe beam radiation to directly probe the die'"'"'s active region.
0 Assignments
0 Petitions
Accused Products
Abstract
Disclosed are a die carrier and associated method for conducting probe beam tests on chips designed to be packaged in flip-chip packages. The die carrier is a specially modified membrane type carrier that includes a probe access region, such as an opening, in the membrane. A die to be tested is mounted in the die carrier such that its I/O pads make electrical contact with corresponding bump contacts on the membrane. The die/carrier assembly is then mounted in a test socket provided on a chip testing apparatus such that electrical I/O signals can be provided to and from an external test circuit. While the die is being electrical tested, a probe beam is directed through the probe access region and onto the chip active surface. In this manner, the chip active surface is probed while exposed to electrical stimulus.
100 Citations
20 Claims
-
1. A die carrier for allowing probing of an active region of a die including peripheral input/output bump pads located about the periphery of the active region, the die carrier comprising:
-
a membrane having a probe access region for making substantially all of the die'"'"'s active region accessible to a probe, a plurality of peripheral bump contacts adjacent to the probe access region and arranged to make electrical contact with the peripheral bump pads of the die, and a plurality of socket contacts electrically connected to said peripheral bump contacts; and
a membrane carrier supporting said membrane and having an opening corresponding, at least in part, to the location of said probe access region of the membrane, wherein the die carrier, including the opening in the membrane carrier together with the probe access region of the membrane, allows probe beam radiation to directly probe the die'"'"'s active region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A die carrier for allowing probing of an active region of a flip-chip die including peripheral input/output bump pads located about the periphery of the active region, the die carrier comprising:
-
a membrane having a probe access region for making substantially all of the flip-chip die'"'"'s active region accessible to a probe, a plurality of peripheral bump contacts adjacent to the probe access region and arranged to make electrical contact with the peripheral bump pads of the flip-chip die, and a plurality of socket contacts electrically connected to said peripheral bump contacts; and
a membrane carrier supporting said membrane and having an opening corresponding, at least in part, to the location of said probe access region of the membrane, wherein the die carrier, including the opening in the membrane carrier together with the probe access region of the membrane, allows probe beam radiation to directly probe the die'"'"'s active region. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
-
Specification