Radiation imaging device with an array of image cells
DCFirst Claim
1. A semiconductor imaging device including an imaging substrate comprising an image cell array of detector cells, each detector cell corresponding to an individual pixel of said image cell array, and which directly generate charge in response to incident high energy radiation, and a counting substrate containing an array of image cell circuits, each image cell circuit being associated with a respective detector cell, said image cell circuit comprising counting circuitry coupled to said respective detector cell, and configured to count plural radiation hits incident on said respective detector cell, wherein the counting substrate is directly connected to the imaging substrate by bump-bonds.
13 Assignments
Litigations
0 Petitions
Accused Products
Abstract
A radiation imaging device includes an image cell array having an array of detector cells and an array of image cell circuits. Each image cell circuit is associated with a respective detector cell and includes counting. The image cell circuits may include threshold circuitry configured to receive signals generated in the respective detector cell and having values dependent on the incident radiation energy. The counting circuitry may be coupled to the threshold circuitry.
66 Citations
19 Claims
- 1. A semiconductor imaging device including an imaging substrate comprising an image cell array of detector cells, each detector cell corresponding to an individual pixel of said image cell array, and which directly generate charge in response to incident high energy radiation, and a counting substrate containing an array of image cell circuits, each image cell circuit being associated with a respective detector cell, said image cell circuit comprising counting circuitry coupled to said respective detector cell, and configured to count plural radiation hits incident on said respective detector cell, wherein the counting substrate is directly connected to the imaging substrate by bump-bonds.
-
13. A semiconductor radiation imaging system including a high energy radiation imaging device, said high energy radiation imaging device including an imaging substrate comprising an image cell array including an array of detector cells which directly generate charge in response to incident radiation and a counting substrate containing an array of image cell circuits, each image cell circuit being associated with a respective detector cell, said image cell circuit comprising counting circuitry coupled to said respective detector cell and configured to count plural radiation hits incident on said respective detector cell, wherein the counting substrate is directly connected to the imaging substrate by bump-bonds.
-
14. A method for high energy radiation imaging using a semiconductor radiation imaging device including an imaging substrate comprising an image cell array, the image cell array having an array of detector cells and a counting substrate containing an array of image cell circuits, wherein each detector cell is coupled to a corresponding image cell circuit, wherein the imaging substrate is directly connected to the counting substrate by bump-bonds, said method comprising the steps of:
-
directly generating charge in response to a radiation hit on a detector cell;
counting radiation hits incident on said detector cell in a corresponding image cell circuit. - View Dependent Claims (15)
-
- 16. A semiconductor radiation imaging device including an imaging substrate comprising an image cell array of detector cells which directly generate charge in response to incident high energy radiation, and a counting substrate containing an array of image cell circuits, each image cell circuit being associated with and proximal to a respective detector cell, said image cell circuit comprising counting circuitry coupled to said respective detector cell and configured to count plural radiation hits incident on said respective detector cell, wherein the imaging substrate is directly connected to the counting substrate by bump-bonds.
-
18. A semiconductor radiation imaging system including a high energy radiation imaging device, said high energy radiation imaging device including an imaging substrate comprising an array of detector cells which directly generate charge in response to incident radiation and a counting substrate containing an array of image cell circuits, each image cell circuit being associated with a respective detector cell, said image cell circuit comprising counting circuitry proximally coupled to said respective detector cell and configured to count plural radiation hits incident on said respective detector cell, wherein the imaging substrate is directly connected to the counting substrate by bump-bonds.
-
19. A semiconductor imaging device including a semiconductor substrate comprising an image cell array of detector cells which directly generate charge in response to incident high energy radiation, the semiconductor substrate further including an array of image cell circuits, each image cell circuit being associated with a respective detector cell, said image cell circuit comprising counting circuitry coupled to said respective detector cell and configured to count plural radiation hits incident on said respective detector cell.
Specification