Sensor cover glass with infrared filter

• US 6,252,220 B1
• Filed: 04/26/1999
• Issued: 06/26/2001
• Est. Priority Date: 04/26/1999
• Status: Expired due to Term

• Current Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Original Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Inventors: Vent, Debra S., Jedlicka, Josef E.
• Primary Examiner(s): Allen, Stephone B.
• Application Number:
  US09/299,122
• Time in Patent Office: 792 Days
• Field of Search: 250/208.1, 358/474, 358/493, 358/494
• US Class Current: 250/208.1
• CPC Class Codes: H01L 27/1462 Coatings
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14687 Wafer level processing

Abstract

The present invention relates to a sensor cover glass for covering photosensitive chips for generating electrical signals from an original image, as would be found for example in a digital scanner, copier, facsimile machine, or other digital imaging device or system. More specifically, the present invention relates to providing a sensor cover glass with an infrared filter material for blocking infrared light from reaching the photosensitive chips. This system is particularly applicable to color input imaging devices or systems.

Claims

1. An assembly comprising:

a substrate;

a plurality of photosensitive chips mounted to the substrate and arranged to provide at least one linear array of photosites on the substrate, each of the photosensitive chips being in contact with a neighboring photosensitive chip;

a sensor cover glass covering the photosensitive chips and mounted to the substrate; and

an infrared filter layer deposited on the sensor cover glass to prevent infrared light from reaching the photosensitive chips.

2. The assembly as in claim 1 wherein the infrared filter layer covers only the top surface of the sensor cover glass from one end of the cover glass to the other end of the cover glass.

3. The assembly as in claim 1 wherein the photosensitive chips provide multiple parallel linear arrays of photosites.

4. The assembly as in claim 3, wherein each multiple parallel linear array has a selectively translucent filter layer.

5. A digital device comprising:

a raster input scanner scanning documents to generate digital image signals, the raster input scanner including an assembly comprising;

a substrate;

a plurality of photosensitive chips mounted to the substrate and arranged to provide at least one linear array of photosites on the substrate, each of the photosensitive chips being in contact with a neighboring photosensitive chip;

a sensor cover glass covering the photosensitive chips and mounted to the substrate; and

an infrared filter layer deposited on the sensor cover glass to prevent infrared light from reaching the photosensitive chips.

6. The digital device as in claim 5, wherein the infrared filter layer covers only the top surface of the sensor cover glass from one end of the cover glass to the other end of the cover glass.

7. The digital device as in claim 5, wherein the photosensitive chips provide multiple parallel linear arrays of photosites.

8. The digital device as in claim 7, wherein each multiple parallel linear array has a selectively translucent filter layer.

9. A digital imaging system comprising:

a raster input scanner scanning documents to generate digital image signals, the raster input scanner including an assembly comprising;

a substrate,

a plurality of photosensitive chips mounted to the substrate and arranged to provide at least one linear array of photosites on the substrate, each of the photosensitive chips being in contact with a neighboring photosensitive chip,

a sensor cover glass covering the photosensitive chips and mounted to the substrate, and

an infrared filter layer deposited on the sensor cover glass to prevent infrared light from reaching the photosensitive chips;

a raster output scanner; and

a controller directing the raster output scanner to expose a photoconductive belt to create an electrostatic latent image based on the image signals received from the raster input scanner.

10. The digital imaging system as in claim 9, wherein the infrared filter layer covers only the top surface of the sensor cover glass from one end of the cover glass to the other end of the cover glass.

11. The digital imaging system as in claim 9, wherein the photosensitive chips provide multiple parallel linear arrays of photosites.

12. The digital imaging system as in claim 11, wherein each multiple parallel linear array has a selectively translucent filter layer.

13. A digital device comprising:

a raster input scanner scanning documents to generate digital image signals, the raster input scanner including an assembly comprising;

a substrate;

a plurality of photosensitive chips mounted to the substrate and arranged to provide at least one linear array of photosites on the substrate, each of the photosensitive chips being in contact with a neighboring photosensitive chip;

a sensor cover glass covering the photosensitive chips, the sensor cover glass having bonding flanges by which the sensor cover glass is mounted to the substrate; and

an infrared filter layer deposited on the sensor cover glass to prevent infrared light from reaching the photosensitive chips.

14. The digital device as in claim 13, wherein the infrared filter layer covers only the top surface of the sensor cover glass from one end of the cover glass to the other end of the cover glass.

15. The digital device as in claim 13, wherein the photosensitive chips provide multiple parallel linear arrays of photosites.

16. The digital device as in claim 15, wherein each multiple parallel linear array has a selectively translucent filter layer.

17. The digital device as in claim 14, wherein the infrared filter layer does not cover over the top of the sensor cover glass in the bonding flange area of the sensor cover glass.