Integrated circuit having a micromagnetic device including a ferromagnetic core and method of manufacture therefor

• US 6,255,714 B1
• Filed: 06/22/1999
• Issued: 07/03/2001
• Est. Priority Date: 06/22/1999
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Agere Systems Guardian Corp. (Broadcom, Inc.)
• Inventors: Lotfi, Ashraf W., Steigerwald, Michael L., Kossives, Dean P., Van Dover, R. Bruce, Schneemeyer, Lynn F.
• Primary Examiner(s): Tran, Minh Loan
• Application Number:
  US09/338,143
• Time in Patent Office: 742 Days
• Field of Search: 257/528, 257/531, 257/532, 333/184, 336/200, 336/205, 336/208, 336/182, 336/196
• US Class Current: 257/528
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01L 27/0688 Integrated circuits having a three-dimensional layout
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H03H 7/01 Frequency selective two-port networks

Abstract

An integrated circuit and method of manufacturing therefor. In one embodiment, the integrated circuit includes a substrate with an insulator and a capacitor formed over the substrate. The integrated circuit further includes an adhesive formed over the insulator. The integrated circuit still further includes a micromagnetic device. The micromagnetic device includes a ferromagnetic core formed over the adhesive. The adhesive forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate. The micromagnetic device also includes at least one winding, located proximate the ferromagnetic core, to impart a desired magnetic property to the ferromagnetic core. The micromagnetic device is electrically coupled to the capacitor.

Claims

1. An integrated circuit comprising:

a substrate;

an insulator located over said substrate;

a capacitor located over said substrate;

a metallic adhesive located over said insulator; and

a micromagnetic device, including;

a ferromagnetic core located over said adhesive, said adhesive forming a bond between said insulator and said ferromagnetic core to secure said ferromagnetic core to said substrate, and

at least one winding, located proximate said ferromagnetic core, to impart a desired magnetic property to said ferromagnetic core, said micromagnetic device electrically coupled to said capacitor.

2. The integrated circuit as recited in claim 1 wherein said micromagnetic device is selected from the group consisting of:

an inductor, and

a transformer.

3. The integrated circuit as recited in claim 1 wherein said integrated circuit is device selected from the group consisting of:

a band pass filter,

a low pass filter,

a notch filter, and

a high pass filter.

4. The integrated circuit as recited in claim 1 further comprising a transistor located over said substrate and electrically coupled to said micromagnetic device.

5. The integrated circuit as recited in claim 4 wherein said integrated circuit is selected from the group consisting of:

a RF circuit,

a motor control circuit,

a data transmission circuit, and

a power processing circuit.

6. The integrated circuit as recited in claim 4 wherein said transistor is a metal-oxide semiconductor field-effect transistor (MOSFET).

7. The integrated circuit as recited in claim 1 wherein said metallic adhesive comprises a plurality of layers.

8. The integrated circuit as recited in claim 1 wherein said ferromagnetic core contains an alloy material.

9. The integrated circuit as recited in claim 1 wherein said insulator includes an organic polymer.

10. An integrated circuit, comprising:

a substrate;

a capacitor located over said substrate, including;

a first capacitive plate layer located over said substrate,

a dielectric layer located over said first capacitive plate layer,

a second capacitive plate layer located over said dielectric layer; and

a micromagnetic device electrically coupled to said capacitor, including;

a first conductive winding layer located over said substrate proximate said capacitor,

a first insulative layer located over said first conductive winding layer,

a metallic adhesive located over said first insulative layer, and

a ferromagnetic core located over said metallic adhesive, said adhesive forming a bond between said first insulative layer and said ferromagnetic core to secure said ferromagnetic core to said substrate.

11. The integrated circuit as recited in claim 10 further comprising a passivation layer interposed between said substrate and said first capacitive plate layer and said first conductive winding layer.

12. The integrated circuit as recited in claim 10 wherein said micromagnetic device further comprises a second insulative layer located over said ferromagnetic core.

13. The integrated circuit as recited in claim 12 wherein said micromagnetic device further comprises a second conductive winding layer located over said second insulative layer.

14. The integrated circuit as recited in claim 13 wherein said micromagnetic device further comprises a third insulative layer located over said second conductive winding layer.

15. The integrated circuit as recited in claim 10 wherein said capacitor and said micromagnetic device further comprise at least one terminal.

16. The integrated circuit as recited in claim 10 wherein said metallic adhesive comprises a layer that contains a material selected from the group consisting of:

zirconium; and

hafnium.

17. The integrated circuit as recited in claim 10 wherein said metallic adhesive comprises a layer that contains a material selected from the group consisting of:

vanadium;

niobium; and

tantalum.

18. The integrated circuit as recited in claim 10 wherein said metallic adhesive comprises a layer that contains a material selected from the group consisting of:

chromium;

molybdenum; and

tungsten.

19. The integrated circuit as recited in claim 10 wherein said metallic adhesive comprises a layer that contains a material selected from the group consisting of:

gold;

silver;

platinum;

palladium; and

copper.

20. The integrated circuit as recited in claim 10 wherein said ferromagnetic core contains an alloy material.

21. The integrated circuit as recited in claim 10 wherein said first insulative layer includes an organic polymer.

22. The integrated circuit as recited in claim 10 wherein said micromagnetic device is selected from the group consisting of:

an inductor, and a transformer.

23. The integrated circuit as recited in claim 10 wherein said integrated circuit is device selected from the group consisting of:

a band pass filter,

a low pass filter,

a notch filter, and

a high pass filter.

24. The integrated circuit as recited in claim 10 further comprising a transistor located over said substrate and electrically coupled to said micromagnetic device.

25. The integrated circuit as recited in claim 24 wherein said integrated circuit is selected from the group consisting of:

a RF circuit,

a motor control circuit,

a data transmission circuit, and

a power processing circuit.

26. The integrated circuit as recited in claim 24 wherein said transistor is a metal-oxide semiconductor field-effect transistor (MOSFET).