Embedded RFID transponder in vehicle window glass

• US 6,275,157 B1
• Filed: 09/21/1999
• Issued: 08/14/2001
• Est. Priority Date: 05/27/1999
• Status: Expired due to Term

• Current Assignee: Intermec IP Corporation (Honeywell International Inc.)
• Original Assignee: Intermec IP Corporation (Honeywell International Inc.)
• Inventors: Mays, Wesley M., Hughes, Peter Scott
• Primary Examiner(s): Hofsass, Jeffery
• Assistant Examiner(s): LA, ANH V
• Application Number:
  US09/401,619
• Time in Patent Office: 693 Days
• Field of Search: 340/572.1, 340/572.5, 340/572.8, 340/572.7, 340/825.34, 340/825.54, 340/572.2, 340/572.4, 340/572.9
• US Class Current: 340/572.5
• CPC Class Codes: B32B 17/06 comprising glass as the main or only constituent of a layer, next to another layer of a specific material
• CPC Class Codes: B32B 17/10174 Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0776 the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
• CPC Class Codes: G07C 5/085 using electronic data carriers

Abstract

An RFID transponder is embedded in a glass surface, such as a vehicle windshield, to provide for the storage and retrieval of vehicle related data. In an embodiment of the invention, the RFID device comprises a flexible circuit substrate with an antenna formed thereon and a transponder circuit disposed on the substrate and coupled to the antenna. In a multi-layer glass panel, the RFID device is disposed between adjacent ones of the glass layers and becomes embedded therein upon lamination of the glass layers together. Alternatively, the RFID device may be formed using one of the glass layers as a substrate, thereby avoiding the need for a distinct substrate layer. Where a glass panel has a transparent conductive layer for thermal insulation, the transparent conductive layer may be used to form a conductive portion of the RFID device. In a single layer glass panel, the RFID device is embedded into the glass while the glass is in a molten or plastic state.

Claims

1. A data transponder, comprising:

a glass panel adapted for viewing visible light therethrough; and

a radio frequency identification (RFID) device comprising a flexible substrate having an antenna and an integrated circuit disposed thereon, wherein said RFID device is at least partially embedded in said glass panel.

2. The data transponder of claim 1, wherein said glass panel further comprises plural glass layers laminated together, said RFID device being disposed between adjacent ones of said plural glass layers.

3. The data transponder of claim 1, wherein said glass panel further comprises a single glass layer.

4. The data transponder of claim 2, wherein said glass panel further comprises a transparent conductive layer disposed between adjacent ones of said plural glass layers, said plural glass layers further comprising a clear area wherein said conductive layer is not present, said RFID device being disposed in said clear area.

5. The data transponder of claim 2, wherein said RFID device further comprises an antenna provided directly onto a surface of one of said plural glass layers.

6. The data transponder of claim 2, wherein said glass panel further comprises a transparent conductive layer disposed between adjacent ones of said plural glass layers, said antenna being formed from a portion of said transparent conductive layer.

7. The data transponder of claim 3, wherein said glass panel further comprises a transparent conductive layer affixed thereto, said antenna being formed from a portion of said transparent conductive layer.

8. The data transponder of claim 1, wherein said flexible circuit substrate further comprises substantially transparent materials.

9. The data transponder of claim 1, further comprising an indicia layer coupled to said flexible circuit substrate, said indicia layer comprising a space permitting indicia to be printed thereon.

10. The data transponder of claim 1, wherein said glass panel further comprises a vehicle windshield.

11. The data transponder of claim 1, wherein said antenna further comprises a dipole antenna.

12. The data transponder of claim 1, wherein said antenna further comprises a patch antenna.

13. The data transponder of claim 1, wherein said integrated circuit further comprises a radio frequency identification (RFID) application specific integrated circuit.

14. The data transponder of claim 1, wherein said integrated circuit further comprises a memory.

15. The data transponder of claim 1, wherein said integrated circuit and said antenna are coupled together on said flexible substrate.

16. The data transponder of claim 1, wherein said RFID device is entirely embedded in said glass panel.

17. The data transponder of claim 1, wherein said RFID device further comprises an antenna embedded in said glass panel and a distributed device disposed externally of said glass panel.

18. The data transponder of claim 17, wherein said distributed device further comprises at least one of an RF receiver and transmitter.

19. The data transponder of claim 1, wherein said antenna has a operational characteristic impedance defined in part by a dielectric constant of said flexible circuit substrate in combination with a dielectric constant of said glass panel.

20. A method for making a data transponder, comprising the steps of:

providing a radio frequency identification (RFID) device comprising a flexible substrate having an antenna and an integrated circuit disposed thereon;

at least partially embedding said RFID device in a glass panel, wherein said glass panel is adapted for viewing visible light therethrough.

21. The method of claim 20, wherein said glass panel further comprises plural glass layers, and said embedding step further comprises disposing said RFID device between adjacent ones of said plural glass layers and laminating said plural glass layers together.

22. The method of claim 20, wherein said glass panel further comprises a single glass layer, and said embedding step further comprises disposing said RFID device in said glass layer while said layer is in a plastic state.

23. The method of claim 21, wherein said embedding step further comprises disposing a transparent conductive layer between adjacent ones of said plural glass layers prior to said laminating step.

24. The method of claim 23, further comprising providing a clear area in said transparent conductive layer wherein said conductive layer is not present, and disposing said RFID device in said clear area.

25. The method of claim 21, wherein said embedding step further comprises providing an antenna for said RFID device directly onto a surface of one of said plural glass layers.

26. The method of claim 25, wherein said step of providing an antenna further comprises at least one of printing, electro-coating, depositing, and sputtering conductive material onto said surface in a desired pattern.

27. The method of claim 23, wherein said embedding step further comprises fabricating an antenna for said RFID device from a portion of said transparent conductive layer.

28. The method of claim 27, wherein said fabricating step further comprises selectively etching a desired antenna pattern from said portion of said transparent conductive layer.

29. The method of claim 20, wherein said step of providing a flexible circuit substrate further comprises providing said flexible circuit substrate comprised of substantially transparent material.

30. The method of claim 20, further comprising coupling an indicia layer to said flexible circuit substrate, said indicia layer comprising a space permitting indicia to be printed thereon.

31. The method of claim 20, wherein said embedding step further comprises embedding said RFID device entirely within said glass panel.

32. The method of claim 20, wherein said embedding step further comprises embedding an antenna of said RFID device in said glass panel and disposing a distributed element of said RFID device externally of said glass panel.

33. The method of claim 21, wherein said step of providing an RFID device further comprises disposing at least conductive portions of said RFID device on an applique.

34. The method of claim 33, wherein said embedding step further comprises transferring said conductive portions of said RFID device from said applique to an interior surface of one of said plural glass layers.