Epoxy resin composition containing unsaturated monomer, curing agent, photoinitiator and epoxy (meth) acrylate

• US 6,277,930 B1
• Filed: 08/04/1999
• Issued: 08/21/2001
• Est. Priority Date: 08/04/1999
• Status: Expired due to Fees

• Current Assignee: Loctite Corporation (Henkel AG & Co KGaA)
• Original Assignee: Loctite Corporation (Henkel AG & Co KGaA)
• Inventors: Nishikawa, Katsue
• Primary Examiner(s): SELLERS, ROBERT E
• Application Number:
  US09/366,766
• Time in Patent Office: 748 Days
• Field of Search: 525/524, 525/526, 522/100, 522/103
• US Class Current: 525/526
• CPC Class Codes: C08G 59/184 with amines
• CPC Class Codes: C08G 59/5073 having two nitrogen atoms in the ring
• CPC Class Codes: C08L 63/10 Epoxy resins modified by unsaturated compounds

Abstract

The present invention relates to an epoxy resin composition used for cap seal of a hard disc drive spindle motor, which hardly causes outgassing even when using in a hard disc for high-speed rotation and has high reliability. The composition comprises an epoxy resin having at least one glycidyl group in a molecule as a component (A), a monomer having at least one unsaturated bond group in a molecule (polyfunctional vinyl monomer or monofunctional vinyl monomer) as a component (B), an epoxy resin curing agent as a component (C), a photopolymerization initiator as a component (D), and a partially-esterified unsaturated epoxy resin wherein 10-90% of an epoxy equivalent of a bisphenol type epoxy resin is (meth)acrylated as a component (E).

Claims

1. An epoxy resin composition used as a cap seal for a hard disc drive spindle motor, comprising the following components (A) to (E):

(A) an epoxy resin having at least two glycidyl groups in a molecule, in an amount within the range of from 50 to 80% by weight;

(B) a monomer having at least one unsaturated bond group in a molecule, in an amount of more than 0% to 30% by weight;

(C) an epoxy resin curing agent;

(D) a photopolymerization initiator, in an amount within the range of from 0.1 to 3% by weight; and

(E) a partially-esterified unsaturated epoxy resin wherein 10-90% of an epoxy equivalent of a bisphenol epoxy resin is (meth)acrylated, in an amount within the range of from 5 to 25% by weight, the amounts of components (A), (B), (D) and (E) based on 100% by weight of the total amounts of components (A) to (E) wherein the amount of the epoxy resin curing agent is from 10 to 40 parts by weight, based on 100 parts by weight of the amount of the epoxy resin and the partially-esterified unsaturated epoxy resin.

2. The epoxy resin composition according to claim 1, wherein the component (A) is a bisphenol A epoxy resin which is liquid at room temperature.

3. The epoxy resin composition according to claim 1, wherein the component (C) is a latent curing agent for an epoxy resin.

4. The epoxy resin composition according to claim 3, wherein the latent curing agent is solid at room temperature and dissolves in the other components upon heating, thereby exerting its curing function.

5. The epoxy resin composition according to claim 1, wherein the component (B) comprises a polyfunctional (meth) acrylate compound.

6. The epoxy resin composition according to claim 1, wherein the bisphenol epoxy resin before (meth)acrylatation to give the partially-esterified unsaturated epoxy resin as component (E) is a bisphenol A epoxy resin.

7. The epoxy resin composition according to claim 1, wherein the epoxy equivalent of the bisphenol epoxy resin before (meth) acrylatation to give the partially-esterified unsaturated epoxy resin as component (E) is from 50 to 500.

8. The epoxy resin composition according to claim 1, wherein the viscosity of the composition is from 1000 to 40,000 cps.