Electrostatic method and apparatus for vaporizing precursors and system for using same

• US 6,280,793 B1
• Filed: 11/20/1996
• Issued: 08/28/2001
• Est. Priority Date: 11/20/1996
• Status: Expired due to Term

• Current Assignee: MOSAID Technologies Inc. (f/k/a Conversant Intellectual Property Management)
• Original Assignee: Micron Technology, Inc.
• Inventors: Vaartstra, Brian A., Atwell, David R.
• Primary Examiner(s): BUEKER, RICHARD R
• Application Number:
  US08/752,834
• Time in Patent Office: 1,742 Days
• Field of Search: 118/726, 392/394, 392/398, 392/401, 427/248.1
• US Class Current: 427/248.1
• CPC Class Codes: C23C 16/4486 by producing an aerosol and subsequent evaporation of the droplets or particles

Abstract

A vaporizing apparatus for providing a vaporized precursor for a vapor deposition process includes a dispensing device for providing precursor spray having a first electrical charge into a vaporization zone. The apparatus further includes a heated element in the vaporization zone having a second electrical charge opposite of the first charge. The heated element vaporizes the precursor spray attracted thereto. The dispensing device may be an electrostatic spray device for spraying a powdered precursor, a mixture of powdered precursors, one or more powdered precursors cut with an inert filler material, one or more liquid precursors adsorbed on solid particles, one or more gas precursors adsorbed on solid particles, a liquid precursor, a mixture of liquid precursors, or one or more solid precursors dissolved in one or more solvents. A method of vaporizing precursors for vapor deposition processes includes providing a precursor spray having a first electrical charge. At least a portion of the precursor spray is vaporized using a heated element having a second electrical charge opposite of the first electrical charge.

Claims

1. A vaporizing apparatus for providing a vaporized precursor for a vapor deposition process, the apparatus comprising:

a dispensing device for providing precursor spray having a first electrical charge into a vaporization zone; and

a heated element in the vaporization zone having a second electrical charge opposite of the first charge, the heated element for vaporizing the precursor spray attracted thereto.

2. The apparatus according to claim 1, wherein the vaporization zone includes a housing defining a vapor flow path from the dispensing device to a process chamber, the vaporization zone for receiving a carrier gas, the carrier gas for moving the vaporized precursor spray into the process chamber.

3. The apparatus according to claim 1, wherein the vaporization zone is located at least in part within the process chamber.

4. The apparatus according to claim 1, wherein the heated element includes a plurality of elements spaced for providing precursor spray flow therebetween.

5. The apparatus according to claim 1, wherein the apparatus includes a directing device to direct the vaporized precursor from the vaporization zone into the process chamber, and further wherein the directing device is the heated element having the second charge.

6. The apparatus according to claim 1, wherein the dispensing device is an electrostatic spray device for spraying a precursor selected from the group consisting of a powdered precursor, a mixture of powdered precursors, one or more powdered precursors cut with an inert filler material, one or more liquid precursors adsorbed on solid particles, one or more gas precursors adsorbed on solid particles, a liquid precursor, a mixture of liquid precursors, and one or more solid precursors dissolved in one or more solvents.

7. The apparatus according to claim 1, wherein the apparatus further includes a detection device for detecting the concentration of unvaporized precursor spray.

8. The apparatus according to claim 7, wherein the detection device includes means for generating a signal representative of the concentration of unvaporized precursor spray, and further wherein the apparatus includes a controller responsive to the signal representative of the detected concentration for initiating modification of a parameter of the vaporizing apparatus.

9. The apparatus according to claim 8, wherein the apparatus further includes means for modifying one of a flow of precursor spray, a temperature of the heated element, a pressure of the vaporization zone, a distance between the heated element and dispensing device, the first electrical charge, and the second electrical charge.

10. A method of vaporizing precursors for vapor deposition processes, the method comprising the steps of:

providing a precursor spray having a first electrical charge; and

vaporizing at least a portion of the precursor spray using a heated element having a second electrical charge opposite of the first electrical charge.

11. The method according to claim 10, wherein the providing step includes applying the first electrical charge to a precursor as it is sprayed into a vaporization zone;

and further wherein the vaporization step includes attracting the charged precursor spray to the heated element for vaporization thereby.

12. The method according to claim 11, further including the step of moving the vaporized precursor spray using a carrier gas into one or more process chambers having one or more deposition surfaces positioned therein.

13. The method according to claim 10, wherein the precursor spray is formed from a precursor selected from the group consisting of a powdered precursor, a mixture of powdered precursors, one or more powdered precursors cut with an inert filler material, one or more liquid precursors adsorbed on solid particles, one or more gas precursors adsorbed on solid particles, a liquid precursor, a mixture of liquid precursors, and one or more solid precursors dissolved in one or more solvents.

14. The method according to claim 10, wherein the method further comprises the step of controlling the vaporization step by adjusting the temperature of the heated element.

15. The method according to claim 10, wherein the method further comprises the step of controlling the vaporization step by adjusting the pressure of a vaporization zone receiving the precursor spray.

16. A vapor deposition system comprising:

an electrostatic spraying device for providing a precursor spray having a first electrical charge;

a housing defining a vaporization zone, the housing including a heated element therein having a second electrical charge for attracting the precursor spray from the electrostatic spraying device and for vaporization of the precursor spray; and

a process chamber for receiving the vaporized precursor spray from the vaporization zone.

17. The system according to claim 16, wherein the vaporization zone, including the heated element therein, is located at least in part within the process chamber.

18. The system according to claim 16, wherein the heated element includes a plurality of elements separated for flow of precursor spray therebetween.

19. The system according to claim 16, wherein the system further includes a directing device to direct the vaporized precursor from the vaporization zone into the process chamber, and further wherein the directing device is the heated element having the second charge and which attracts and vaporizes the precursor spray.

20. A method of vaporizing precursors for vapor deposition processes, the method comprising the steps of:

providing electrically charged precursor powder particles;

attracting the charged powder precursor particles to a heated element having a charge opposite of the charged precursor powder particles; and

vaporizing the charged precursor powder particles with the heated element.

21. A method of vaporizing precursors for vapor deposition processes, the method comprising the steps of:

providing electrically charged precursor microdroplets;

attracting the charged precursor microdroplets to a heated element having a charge opposite of the charged precursor microdroplets; and

vaporizing the charged precursor microdroplets using the heated element.

22. A method of controlling the vaporization of precursors for vapor deposition processes, the method comprising the steps of:

using an electrically charged and heated element to attract thereto and to vaporize a precursor spray of opposite charge;

detecting the concentration of unvaporized precursor spray; and

controlling the vaporization of the precursor spray as a function of the detected concentration.

23. The method according to claim 22, wherein the controlling step includes controlling one of a temperature of the heated element, the charge of the heated element, the charge of the precursor spray, a distance between the heated element and a dispensing device used for providing the precursor spray, and a pressure of a vaporization chamber into which the precursor spray is sprayed and in which the precursor is vaporized.

24. A vaporizing apparatus for providing a vaporized precursor to a process chamber in a vapor deposition process, the apparatus comprising:

an electrostatic dispensing device for providing precursor spray having a first electrical charge;

a pressurizable chamber defining a vaporization zone for receiving the electrically charged precursor spray and a carrier gas; and

a heated element in the vaporization zone having a second electrical charge opposite of the first charge, the heated element for vaporizing the precursor spray attracted thereto, the carrier gas for moving the vaporized precursor spray into the process chamber.