Electronic surface mount package

  • US 6,297,720 B1
  • Filed: 12/27/1996
  • Issued: 10/02/2001
  • Est. Priority Date: 08/10/1995
  • Status: Expired due to Term
First Claim
Patent Images

1. An electronic surface mount package for mounting onto the surface of a printed circuit board in an electronic device, said package comprising:

  • a one piece open construction package having a side wall, a plurality of toroid transformers within said package, said toroid transformers each having wires wound thereon, a plurality of terminal pins molded within the side wall of said package, the ends of the terminal pins forming solder posts and extending through and below the bottom of said side wall, said solder posts each having an hour-glass shaped notch upon which said wires from said transformers are wrapped and soldered thereon, respectively, the other end of each of the terminal pins extending in gull wing fashion outwardly from the side wall and below the bottom of the package for mounting onto the surface of the printed circuit board.

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