Pad-on-via assembly technique

• US 6,300,578 B1
• Filed: 02/24/2000
• Issued: 10/09/2001
• Est. Priority Date: 07/01/1998
• Status: Expired due to Term

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Hoffmeyer, Mark Kenneth, Isaacs, Phillip Duane
• Primary Examiner(s): Paladini, Albert W.
• Assistant Examiner(s): NORRIS, JEREMY C
• Application Number:
  US09/512,131
• Time in Patent Office: 593 Days
• Field of Search: 174/259, 174/262, 174/263, 174/264, 174/265, 174/266, 174/260, 361/760, 361/767, 257/774, 228/180.21
• US Class Current: 174/263
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: H05K 2201/09481 Via in pad; Pad over filled via if used for surface mounting H05K1/113
• CPC Class Codes: H05K 2201/09572 Solder filled plated through-hole in the final product soldering lead-in-hole components H05K3/3447
• CPC Class Codes: H05K 2201/10992 Using different connection materials, e.g. different solders, for the same connection
• CPC Class Codes: H05K 2201/2081 Compound repelling a metal, e.g. solder
• CPC Class Codes: H05K 2203/043 Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
• CPC Class Codes: H05K 2203/0455 PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3452 Solder masks
• CPC Class Codes: H05K 3/3463 Solder compositions in relation to features of the printed circuit board or the mounting process
• CPC Class Codes: H05K 3/3485 Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

Fine pitch area array packaging is achieved using a via-in-pad design within the area array attach portion of a printed circuit board (PCB). The limitation of the design is the wicking action, whereby solder applied to the capture pad contact surface is depleted by capillary action into the via hole when reflowed, causing insufficient solder to be present at the contact surface to effect reliable and repeatable electrical connections. In one implementation, an initial application of solder is applied to plug the via hole with a material having a higher final melting temperature than eutectic solder, thereby providing a stable plug. This plug is formed by the initial solder application that may be either a eutectic solder containing a third metal that forms intermetallic compounds, when reflowed, that elevate the liquidus temperature or a solder having a different formulation with an inherent higher melting temperature. An alternative implementation is to plate the via hole with a material, such as nickel, which prevents eutectic solder, applied to the via capture pad contact surface, from wetting the hole surface and being drawn away from the contact surface by capillary action. Thus, the solder, applied to the via capture pad and used to establish an electrical connection is not depleted.

Claims

1. An electrical attachment structure between the electrical contact surface of a component and a circuit board plated through via hole which includes a barrel surface with said hole and a radially extending via capture pad at least one surface of said circuit board for electrical connection to said component contact surface comprising:

a material applied to a portion of the via structure which prevents reflowed attachment solder, applied at the via capture pad contact surface, from entering the via hole; and

a Sn/Pb solder applied at the via capture pad surface, which is reflowed to electrically connect said via capture pad to a confronting component connector surface;

wherein said material applied to said portion of the via structure is different from said Sn/Pb solder applied at the via capture pad surface, wherein said material applied to a said portion of the via structure is an alternative solder formulation which is made to fill a portion of said via hole forming a plug, said alternative solder formulation having a liquidus temperature above the reflow temperature of said Sn/Pb solder applied at the via capture pad surface .

2. The electrical attachment structure of claim 1, wherein said material applied to said portion of the via structure is a Sn/Pb solder which is wicked into the via hole to form a plug, said Sn/Pb solder which is wicked into the via hole to form a plug containing particles of a third metal which, upon reflow, forms an intermetallic phase that increases the liquidus temperature and melting point range of said solder plug above those of said Sn/Pb solder applied at the via capture pad surface.

3. The electrical attachment structure of claim 2, wherein said third metal is selected from the group consisting of palladium and silver.

4. An electrical attachment structure between the electrical contact surface of a component and a circuit board plated through via hole which includes a barrel surface with said hole and a radially extending via capture pad at least one surface of said circuit board for electrical connection to said component contact surface comprising:

a material applied to a portion of the via structure which prevents reflowed attachment solder, applied at the via capture pad contact surface, from entering the via hole; and

a Sn/Pb solder applied at the via capture pad surface, which is reflowed to electrically connect said via capture pad to a confronting component connector surface;

wherein said material applied to said portion of the via structure is different from said Sn/Pb solder applied at the via capture pad surface, wherein said material applied to said portion of the via structure is a solder paste introduced into said via hole to form a plug and formulated to have a liquidus temperature at least 25 degrees centigrade higher than the melting point of the Sn/Pb solder applied at the via capture pad surface.

5. The electrical attachment structure of claim 4, wherein said solder paste is Sn/Ag solder.

6. An electrical attachment structure between the electrical contact surface of a component and a circuit board plated through via hole which includes a barrel surface with said hole and a radially extending via capture pad at least one surface of said circuit board for electrical connection to said component contact surface comprising:

a material applied to a portion of the via structure which prevents reflowed attachment solder, applied at the via capture pad contact surface, from entering the via hole, wherein said material applied to said portion of the via structure is a plated metal layer on the barrel surface of said via which prevents wetting by the Sn/Pb solder; and

a Sn/Pb solder applied at the via capture pad surface, which is reflowed to electrically connect said via capture pad to a confronting component connector surface.

7. The electrical attachment structure of claim 6, wherein said plated metal layer is nickel.