Inter-substrate conductive mount for a circuit board, circuit board and power magnetic device employing the same

  • US 6,310,301 B1
  • Filed: 04/08/1999
  • Issued: 10/30/2001
  • Est. Priority Date: 04/08/1999
  • Status: Active Grant
First Claim
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1. A surface mountable circuit board for a power supply, comprising:

  • a substrate having electrical components on opposing faces thereof;

    an inter-substrate conductive mount composed of a material having a melting point above a solder reflow temperature and including a compliant solder joint at an interface of said substrate; and

    a solder located proximate said conductive mount, said conductive mount of a sufficiently low weight such that a surface tension of a liquid state of said solder is sufficient to maintain said conductive mount in contact with said substrate as said solder is brought to said reflow temperature, said conductive mount being capable of mounting said substrate to an adjacent substrate and providing a conductive path therebetween.

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