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Apparatus and method for manufacturing an intracutaneous microneedle array

  • US 6,312,612 B1
  • Filed: 06/09/1999
  • Issued: 11/06/2001
  • Est. Priority Date: 06/09/1999
  • Status: Expired due to Term
First Claim
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1. A method of manufacturing a microneedle array, comprising:

  • (a) providing a semiconductor wafer;

    (b) creating a plurality of annular oxide patterns on the top surface of said wafer;

    (c) forming a plurality of indentations in the bottom surface;

    (d) forming, by etching away material, a plurality of needle-like projections in the top surface of said wafer, said needle-like projections having locations that are aligned with said indentations; and

    (e) forming a plurality of through holes in said plurality of needle-like projections, thereby creating an array of hollow microneedles.

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