Apparatus and method for manufacturing an intracutaneous microneedle array
First Claim
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1. A method of manufacturing a microneedle array, comprising:
- (a) providing a semiconductor wafer;
(b) creating a plurality of annular oxide patterns on the top surface of said wafer;
(c) forming a plurality of indentations in the bottom surface;
(d) forming, by etching away material, a plurality of needle-like projections in the top surface of said wafer, said needle-like projections having locations that are aligned with said indentations; and
(e) forming a plurality of through holes in said plurality of needle-like projections, thereby creating an array of hollow microneedles.
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Abstract
A microneedle array is constructed of silicon and silicon dioxide compounds using MEMS (i.e., Micro-Electro-Mechanical-Systems) technology and standard microfabrication techniques. The microneedle array may be fabricated from a silicon die which can be etched in a microfabrication process to create hollow cylindrical individual microneedles. The resulting array of microneedles can penetrate with a small pressure through the stratum corneum of skin (including skin of animals, reptiles, or other creatures—typically skin of a living organism) to either deliver drugs or to facilitate interstitial fluid sampling through the hollow microneedles.
508 Citations
7 Claims
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1. A method of manufacturing a microneedle array, comprising:
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(a) providing a semiconductor wafer;
(b) creating a plurality of annular oxide patterns on the top surface of said wafer;
(c) forming a plurality of indentations in the bottom surface;
(d) forming, by etching away material, a plurality of needle-like projections in the top surface of said wafer, said needle-like projections having locations that are aligned with said indentations; and
(e) forming a plurality of through holes in said plurality of needle-like projections, thereby creating an array of hollow microneedles. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification