Infrared correction in color scanners

• US 6,316,284 B1
• Filed: 09/07/2000
• Issued: 11/13/2001
• Est. Priority Date: 09/07/2000
• Status: Expired due to Term

• Current Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Original Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Inventors: Jedlicka, Josef E., Perregaux, Alain E.
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): Nhu, David
• Application Number:
  US09/656,879
• Time in Patent Office: 432 Days
• Field of Search: 438/60, 438/68, 438/70, 438/73, 438/75, 438/612, 438/48, 438/113, 438/118, 438/460, 438/462
• US Class Current: 438/70
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements

Abstract

The present invention generally relates to a digital scanner for scanning images. More specifically, the present invention is directed to a method and apparatus for enhancing the quality of scanned images obtained by filtering out the infrared component of digital data to provide enhanced digital images.

Claims

1. A method for fabricating semiconductor chips comprising:

(a) providing a semiconductor wafer having a main surface defining chip areas, the chip areas defining bonding pads and three linear arrays of photosites;

(b) depositing a clear layer on the semiconductor wafer;

(c) depositing a first primary color filter layer on a first linear array of photosites;

(d) depositing a second primary color filter layer on a second linear array of photosites;

(e) depositing a third primary color filter layer on a regularly-spaced subset of photosites of a third linear array of photosites; and

(f) depositing an infrared filter layer on the photosites in the third linear array which are not in said subset of photosites.

2. The method for fabricating a semiconductor chips as in claim 1, further comprising dicing the semiconductor wafer to provide semiconductor chips.

3. The method of fabricating semiconductor chips as in claim 2, further comprises assembling the semiconductor chips end to end on a substrate to form a full width array.

4. The method of fabricating semiconductor chips as in claim 1, wherein the infrared filter layer includes polyimide.

5. The method of fabricating semiconductor chips as in claim 1, wherein the primary color filter layers include polyimide.

6. The method of fabricating semiconductor chips as in claim 1, wherein the primary color filter layers include acrylic.

7. The method of fabricating semiconductor chips as in claim 1, wherein the third primary color filter layer is blue.

8. A method for fabricating semiconductor chips comprising:

(a) providing a semiconductor wafer having a main surface defining chip areas, the chip areas defining bonding pads and three linear arrays of photosites;

(b) depositing a clear layer on the semiconductor wafer;

(c) depositing a first primary color filter layer on a first linear array of photosites;

(d) depositing a second primary color filter layer on a regularly-spaced subset of photosites of a second linear array of photosites;

(e) depositing a third primary color filter layer on a third linear array of photosites; and

(f) depositing an infrared filter layer on the, photosites in the second linear array which are not in said subset of photosites.

9. The method for fabricating a semiconductor chips as in claim 8, further comprising dicing the semiconductor wafer to provide semiconductor chips.

10. The method of fabricating semiconductor chips as in claim 9, further comprises assembling the semiconductor chips end to end on a substrate to form a full width array.

11. The method of fabricating semiconductor chips as in claim 8, wherein the infrared filter layer includes polyimide.

12. The method of fabricating semiconductor chips as in claim 8, wherein the primary color filter layers include polyimide.

13. The method of fabricating semiconductor chips as in claim 8, wherein the primary color filter layers include acrylic.

14. The method of fabricating semiconductor chips as in claim 8, wherein the second primary color filter layer is red.