Apparatus and method for filling a ball grid array

  • US 6,325,272 B1
  • Filed: 10/09/1998
  • Issued: 12/04/2001
  • Est. Priority Date: 10/09/1998
  • Status: Expired due to Fees
First Claim
Patent Images

1. An apparatus for placing solder balls in a pattern on a substrate, each of the solder balls having a solder ball diameter, the apparatus comprising:

  • a template having a first plane, a second plane, and a plurality of holes passing substantially orthogonally through the first and second planes parallel to an axis and corresponding in location to the pattern, each of the holes being slightly larger than the solder ball diameter;

    a porous base having first and second planes, the first plane of the base contacting the second plane of the template, the base being permeable to a fluid in a first direction from the first plane of the template toward the second plane of the base; and

    a fluid controller in fluid communication with the base for selectively causing the fluid to pass through the holes and through the base in the first direction to force the solder balls into the holes, wherein the base comprises a carbon material.

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