Bonding pads for integrated circuits having copper interconnect metallization

  • US 6,329,722 B1
  • Filed: 07/01/1999
  • Issued: 12/11/2001
  • Est. Priority Date: 07/01/1999
  • Status: Expired due to Term
First Claim
Patent Images

1. An integrated circuit having copper interconnect metallization which includes an array of bonding pads, said bonding pads consisting essentially of copper and a coating of tin on the copper;

  • and a bond wire attached to at least one of said bonding pads.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×