Method and apparatus for fabricating a pressure-wave sensor with a leveling support element

• US 6,331,161 B1
• Filed: 09/10/1999
• Issued: 12/18/2001
• Est. Priority Date: 09/10/1999
• Status: Expired due to Term

• Current Assignee: Hypertension Diagnostics, Inc.
• Original Assignee: Hypertension Diagnostics, Inc.
• Inventors: Lemaire, Charles A., Chesney, Charles F., Riggs, Michael Terry
• Primary Examiner(s): Nasser, Robert L.
• Application Number:
  US09/394,301
• Time in Patent Office: 830 Days
• Field of Search: 600/485, 600/486, 600/488, 600/500, 600/561
• US Class Current: 600/485
• CPC Class Codes: A61B 2562/0247 Pressure sensors
• CPC Class Codes: A61B 2562/12 Manufacturing methods specially adapted for producing sensors for in-vivo measurements
• CPC Class Codes: A61B 5/021 Measuring pressure in heart or blood vessels A61B5/0205 takes precedence
• CPC Class Codes: A61B 5/0285 Measuring or recording phase velocity of blood waves
• CPC Class Codes: G01L 19/142 Multiple part housings
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: G01L 9/008 using piezoelectric devices piezoelectric resonators G01L9/0022; surface acoustic waves G01L9/0025
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A method and an apparatus for fabricating a pressure-waveform sensor with a leveling support element. One embodiment provides a pressure-waveform sensor having a housing, a support element, and a piezoelectric element having a first end secured between the support element and the housing, and a second end in a cantilevered orientation. The support element and the piezoelectric element together form a plurality of support regions to level the piezoelectric element and relative to the housing. In some embodiments, the support element includes a ring having three slots spaced apart on one face of the ring, or one or more support regions formed with a shim having a thickness equal to a thickness of the piezoelectric device, or support regions that are integral to the support element. Another aspect provides a method for fabricating a pressure-waveform sensor. The method includes the steps of forming a housing structure with an inner lip, and supporting a cantilevered piezoelectric element with a support structure such that contact is made with the inner lip at a plurality of points in order to level the piezoelectric element relative to the inner lip.

Claims

1. A pressure-waveform sensor comprising:

a housing;

a support element; and

a piezoelectric element having a first end secured between the support element and the housing, and a second end in a cantilevered orientation;

wherein the support element and the piezoelectric element together form a plurality of support regions to level the piezoelectric element relative to the housing.

2. The sensor according to claim 1, wherein one or more of the plurality of support regions are formed with one or more shims having a thickness sufficient to level the piezoelectric element relative to the housing.

3. The sensor according to claim 2, wherein each one of the one or more shims has a thickness equal to a thickness of the piezoelectric device.

4. The sensor according to claim 2, wherein each one of the one or more shims has a cylindrical shape.

5. The sensor according to claim 1, further comprising a diaphragm displacementally coupled to the second end of the piezoelectric element.

6. The sensor according to claim 1, wherein the support element comprises a ring, the ring including three slots spaced apart on one face of the ring, and having the piezoelectric element mounted to a first one of the slots.

7. The sensor according to claim 6, wherein the ring further comprises wire leveler elements mounted in a second and a third of the three slots to provide two of the support regions.

8. The sensor according to claim 5, wherein the ring further comprises wire leveler elements mounted in a second and a third of the three slots to provide two of the support regions.

9. The sensor according to claim 1, wherein the support element comprises a first face region for attaching to the first end of the piezoelectric element, a second face region elevated relative to the first face region to provide one or more of the plurality of support regions.

10. The sensor according to claim 9, wherein the support regions of the second face region are integral to the support element.

11. The sensor according to claim 1, wherein the support regions of the support element and the piezoelectric element are coplanar.

12. The sensor according to claim 1, further comprising a post secured to the cantilevered piezoelectric element;

wherein the support regions of the support element and the piezoelectric element are coplanar and wherein the post extends below the plane of the support regions.

13. The sensor according to claim 1, further comprising an amplifier secured to a surface of the support element by epoxy.

14. The sensor according to claim 1, wherein the support element comprises a ring, the ring including a plurality of slots spaced apart on one face of the ring, and having the piezoelectric element mounted to a first one of the slots, and further including leveler elements mounted in a second and a third of the three slots to provide two of the support regions.

15. The sensor according to claim 1, wherein the support element comprises a ring, the ring including three slots spaced apart on one face of the ring, and having the piezoelectric element mounted to a first one of the slots.

16. An arterial-pulse sensor comprising:

a rigid housing having a diaphragm;

an electrical amplifier mounted within the housing;

a piezoelectric element mounted within the housing, mechanically coupled to the diaphragm, and electrically coupled to the amplifier; and

support means for leveling the piezoelectric element within the housing.

17. The sensor according to claim 16, wherein the piezoelectric element is mechanically coupled to a vibrating portion of the diaphragm using a rigid connecting element.

18. The sensor according to claim 16, further comprising:

a support element, wherein the piezoelectric element has a first end secured between the support element and the housing, and wherein the support means for leveling functions to level both the support element and the piezoelectric element within the housing.

20. The sensor according to claim 18, wherein each one of the one or more shims has a rectangular cross-section.

21. The sensor according to claim 18, wherein each one of the one or more shims has a cylindrical shape.

19. A pressure-waveform sensor comprising:

a housing;

a support element; and

a piezoelectric element having a first end secured between the support element and the housing, and a second end in a cantilevered orientation, wherein the support element has a plurality of slots, and the piezoelectric element is secured in one of the slots, and a shim is secured in each one of one or more others of the slots to level the piezoelectric element relative to the housing.

22. A pressure-waveform sensor comprising:

a housing;

a support element; and

a piezoelectric element having a first end secured between the support element and the housing, and a second end in a cantilevered orientation, wherein the support element has one or more raised areas and a slot, and the piezoelectric element is secured in the slot to level the piezoelectric element relative to the housing.