Semiconductor radiation emitter package

  • US 6,335,548 B1
  • Filed: 10/22/1999
  • Issued: 01/01/2002
  • Est. Priority Date: 03/15/1999
  • Status: Expired due to Term
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First Claim
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1. A semiconductor radiation emitter package comprising:

  • a heat extraction member having a low thermal resistance;

    at least one semiconductor radiation emitter in thermal contact with the heat extraction member, said at least one semiconductor radiation emitter having an anode and a cathode for energizing the semiconductor radiation emitter;

    at least one anodic electrical lead coupled to an anode of at least one of said semiconductor radiation emitters, said at least one anodic electrical lead having a high thermal resistance;

    at least one cathodic electrical lead coupled to a cathode of at least one of said semiconductor radiation emitters, said at least one cathodic electrical lead having a high thermal resistance; and

    an encapsulant substantially transparent to radiation from said at least one semiconductor radiation emitter, the encapsulant formed to cover each semiconductor radiation emitter, a portion of said at least one anodic electrical lead, a portion of each cathodic electrical lead, and a portion of the heat extraction member.

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