Method of fabricating an interconnection element
First Claim
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1. A method of fabricating an interconnection element having a contact tip structure, comprising:
- forming a contact tip structure on a sacrificial substrate;
prior to constructing the contact tip structure, providing a selected topography in an area of the sacrificial substrate by imposing an articulation in the sacrificial substrate, wherein the contact tip structure is formed on the area of the sacrificial substrate which is formed with the selected topography;
attaching an interconnection element to the contact tip structure to form a first structure having the interconnection element and the contact tip structure; and
removing the contact tip structure from the sacrificial substrate wherein the first structure is resilient after said removing of the contact tip structure.
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Abstract
Contact structures formed on an electronic component are useful for connecting the component to other electronic components. A contact tip structure can be formed on a sacrificial substrate, then combined with an interconnection element. A preferred contact structure includes some topography, generally in the form of certain raised features. These are formed by embossing depressed features into the sacrificial substrate upon which the contact tip structure is constructed. The contact tip structure can be optimized for making contact with another electrical component.
508 Citations
23 Claims
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1. A method of fabricating an interconnection element having a contact tip structure, comprising:
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forming a contact tip structure on a sacrificial substrate;
prior to constructing the contact tip structure, providing a selected topography in an area of the sacrificial substrate by imposing an articulation in the sacrificial substrate, wherein the contact tip structure is formed on the area of the sacrificial substrate which is formed with the selected topography;
attaching an interconnection element to the contact tip structure to form a first structure having the interconnection element and the contact tip structure; and
removing the contact tip structure from the sacrificial substrate wherein the first structure is resilient after said removing of the contact tip structure.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
the imposing an articulation comprises etching.
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3. The method, according to claim 1, wherein:
the imposing an articulation comprises micromachining.
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4. The method, according to claim 1, wherein:
the embossing comprises a lithographic process.
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5. The method, according to claim 1, wherein:
the contact tip structure comprises multiple metallic layers.
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6. The method, according to claim 5, wherein:
the contact tip comprises a surface material which in the finished product will form a contact layer of the contact tip structure.
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7. The method, according to claim 6, wherein:
the surface material comprises a material suitable for making contact with an electronic component.
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8. The method, according to claim 6, wherein:
the surface material comprises a material selected from the list consisting of hard gold and rhodium.
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9. The method, according to claim 5, wherein:
the contact tip comprises a main tip material to provide strength to the contact tip structure.
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10. The method, according to claim 9, wherein:
the main tip material comprises nickel.
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11. The method, according to claim 9, wherein:
the main tip material comprises a material selected from the list consisting of nickel, cobalt, and iron.
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12. The method, according to claim 5, wherein:
the contact tip comprises a bonding material for joining to the contact tip structure.
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13. The method, according to claim 12, wherein:
the bonding material comprises a material suitable for bonding to an interconnection element.
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14. The method, according to claim 12, wherein:
the bonding material comprises a material selected from the list consisting of soft gold and hard gold.
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15. The method, according to claim 1, wherein:
the contact tip structure is formed as part of a cantilevered interconnect structure.
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16. The method, according to claim 1, wherein:
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the interconnection element has a core element and a shell;
the core element is readily-shaped and comprises a material selected from the group consisting of;
(a) gold, aluminum and copper with small amounts of beryllium, cadmium, silicon and magnesium, and (b) metals of the platinum group, and (c) lead, tin, indium.
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17. The method, according to claim 1, wherein:
the interconnection element is elongate and provides the resiliency of the first structure.
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18. The method, according to claim 17, wherein:
the interconnection element has a relatively flexible core element and a layer on the core element.
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19. The method, according to claim 17, wherein:
the interconnection element has a relatively flexible core and a layer, on the core element, comprising a material selected from the group consisting of nickel and cobalt.
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20. The method, according to claim 18, wherein:
the core element comprises gold.
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21. The method, according to claim 18, wherein:
the core element comprises gold and the shell layer comprises a material selected from the group consisting of nickel and cobalt.
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22. The method, according to claim 18, wherein:
the layer comprises a material which is selected for its ability to provide mechanical properties selected from the group consisting of spring properties, resiliency yield strength and compliance for the interconnection element.
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23. The method, according to claim 18, wherein:
the layer comprises a material selected from the group consisting of nickel, iron, and cobalt.
Specification