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Interconnect-integrated metal-insulator-metal capacitor and method of fabricating same

DC
  • US 6,342,734 B1
  • Filed: 04/27/2000
  • Issued: 01/29/2002
  • Est. Priority Date: 04/27/2000
  • Status: Expired due to Term
First Claim
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1. In an integrated circuit (IC) having a substrate containing functional components and an interconnect layer overlying the substrate to connect selected ones of the functional components, an improvement comprising:

  • a capacitor comprising two plates and a dielectric layer interposed between the two plates, a bottom one of the plates comprising a portion of the interconnect layer and a top one of the plates comprising a single metal layer.

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