Electronic surface mount package

CAFC
  • US 6,344,785 B1
  • Filed: 08/06/1997
  • Issued: 02/05/2002
  • Est. Priority Date: 08/10/1995
  • Status: Expired due to Term
First Claim
Patent Images

1. An electronic surface mount package for mounting onto the surface of a printed circuit board comprising:

  • a side wall with a bottom end, a plurality of toroid transformers within the package, the toroid transformers each having wires wrapped thereon, a plurality of terminal pins molded within the side wall, each of the pins extending through the side wall and having a solder post with an end upon which the wires from the transformers are respectively wrapped and soldered thereon, each of the post ends extending beyond the bottom end of the side wall.

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