Method of manufacturing and testing an electronic device, and a electronic device

• US 6,344,792 B1
• Filed: 07/17/2000
• Issued: 02/05/2002
• Est. Priority Date: 10/20/1997
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Tuttle, Mark E., Lake, Rickie C., Medlen, Curtis M.
• Primary Examiner(s): Zimmerman, Brian
• Assistant Examiner(s): Dalencourt, Yves
• Application Number:
  US09/617,636
• Time in Patent Office: 568 Days
• Field of Search: 340/10.42, 174/254, 298/46, 361/749, 361/750, 361/751
• US Class Current: 340/10.42
• CPC Class Codes: G01R 31/70 Testing of connections between components and printed circuit boards G01R31/68 takes precedence
• CPC Class Codes: H05K 1/0268 for electrical inspection or testing
• CPC Class Codes: H05K 1/0293 Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
• CPC Class Codes: H05K 2201/10037 Printed or non-printed battery
• CPC Class Codes: H05K 2203/173 Adding connections between adjacent pads or conductors, e.g. for modifying or repairing programmable, customizable or modifiable circuits H05K1/0286
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49108 Electric battery cell making
• CPC Class Codes: Y10T 29/49115 including coating or impregnating
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A method of manufacturing and testing an electronic circuit, the method comprising forming a plurality of conductive traces on a substrate and providing a gap in one of the conductive traces; attaching a circuit component to the substrate and coupling the circuit component to at least one of the conductive traces; supporting a battery on the substrate, and coupling the battery to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap; verifying electrical connections by performing an in circuit test, after the circuit component is attached and the battery is supported; and employing a jumper to electrically close the gap, and complete the circuit, after verifying electrical connections. An electronic circuit comprising a substrate; a plurality of conductive traces on the substrate, with a gap in one of the conductive traces; a circuit component attached to the substrate and coupled to at least one of the conductive traces; a battery supported on the substrate and coupled to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap; and a jumper electrically closing the gap and completing the circuit, the jumper comprising conductive epoxy.

Claims

1. An electronic circuit comprising:

a flexible plastic film substrate;

first and second conductive traces on the substrate, the first trace having a first terminal and the second trace having a second terminal spaced apart from the first portion;

an integrated circuit supported by the substrate and coupled to at least one of the conductive traces, the integrated circuit defining a wireless identification device and including a microprocessor, a receiver coupled to the microprocessor, a modulator coupled to the microprocessor, and a memory coupled to the microprocessor;

a battery supported by the substrate and coupled to the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, when the first terminal is coupled to the second terminal;

conductive epoxy at least in part supporting the battery from the substrate and coupling the battery to the at least one conductive trace; and

a drop of conductive epoxy electrically coupling the first terminal to the second terminal and completing the circuit.

2. An electronic circuit in accordance with claim 1 wherein the receiver is configured to receive microwave frequencies.

3. An electronic circuit in accordance with claim 1 wherein the modulator is a backscatter modulator.

4. An electronic circuit comprising:

a polyester film substrate;

first and second conductive traces on the substrate, the first trace having a first terminal and the second trace having a second terminal spaced apart from the first terminal by a gap;

an integrated circuit supported by the substrate and coupled to at least one of the conductive traces, the integrated circuit defining a wireless identification device and including a microprocessor, a microwave receiver coupled to the microprocessor, a backscatter modulator coupled to the microprocessor, and a memory coupled to the microprocessor;

a battery supported on the substrate and coupled to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, integrated circuit, and battery, when the first terminal is coupled to the second terminal;

conductive epoxy at least in part supporting the battery from the substrate and coupling the battery to the at least one conductive trace; and

a jumper electrically closing the gap and completing the circuit, the jumper consisting essentially of a drop of conductive epoxy having a resistance of less than 1000 ohms prior to curing.

5. An electronic circuit in accordance with claim 4 wherein the receiver is configured to receive microwave frequencies.

6. An electronic circuit in accordance with claim 4 wherein the modulator is a backscatter modulator.

7. An electronic circuit comprising:

a polyester film substrate;

first and second conductive traces on the substrate, the first trace having a first portion and the second trace having a second portion spaced apart from the first portion by a gap;

an integrated circuit attached to the substrate and coupled to at least one of the conductive traces, the integrated circuit defining a wireless identification device and including a microprocessor, a microwave receiver coupled to the microprocessor, a backscatter modulator coupled to the microprocessor, and a memory coupled to the microprocessor;

a battery supported on the substrate and coupled to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, integrated circuit, and battery, if the first portion was coupled to the second portion;

conductive epoxy at least in part supporting the battery from the substrate and coupling the battery to the at least one conductive trace; and

a jumper electrically closing the gap and completing the circuit, the jumper comprising a discrete component resistor across the gap, wherein the conductive epoxy couples the resistor to the conductive traces on either side of the gap.

8. An electronic circuit in accordance with claim 7 wherein the receiver is configured to receive microwave frequencies.

9. An electronic circuit in accordance with claim 7 wherein the modulator is a backscatter modulator.

10. An electronic circuit comprising:

a polyester film substrate;

first and second conductive traces on the substrate, the first trace having a first portion and the second trace having a second portion spaced apart from the first portion by a gap;

an integrated circuit attached to the substrate and coupled to at least one of the conductive traces, the integrated circuit defining a wireless identification device and including a microprocessor, a microwave receiver coupled to the microprocessor, a backscatter modulator coupled to the microprocessor, and a memory coupled to the microprocessor;

a battery supported on the substrate and coupled to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, integrated circuit, and battery, if the first portion was coupled to the second portion;

conductive epoxy at least in part supporting the battery from the substrate and coupling the battery to the at least one conductive trace;

conductive epoxy on the first portion, and conductive epoxy on the second portion; and

a jumper electrically closing the gap and completing the circuit, the jumper comprising a metal conductor extending between the conductive epoxy on the first and second portions and secured to the first and second portions by the conductive epoxy.

11. An electronic circuit in accordance with claim 10 wherein the receiver is configured to receive microwave frequencies.

12. An electronic circuit in accordance with claim 10 wherein the modulator is a backscatter modulator.

13. An electronic circuit comprising:

a flexible plastic film substrate;

first and second conductive traces supported by the substrate, the first trace having a first terminal and the second trace having a second terminal spaced apart from the first portion;

an integrated circuit supported by the substrate and coupled to at least one of the conductive traces, the integrated circuit defining a wireless identification device and including a microprocessor, a receiver coupled to the microprocessor, a modulator coupled to the microprocessor, and a memory coupled to the microprocessor;

a battery supported by the substrate and coupled to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, when the first terminal is coupled to the second terminal;

conductive epoxy at least in part supporting the battery from the substrate and coupling the battery to the at least one conductive trace; and

conductive epoxy electrically coupling the first terminal to the second terminal and completing the circuit.

14. An electronic circuit in accordance with claim 13 wherein the receiver is configured to receive microwave frequencies.

15. An electronic circuit in accordance with claim 13 wherein the modulator is a backscatter modulator.

16. An electronic circuit comprising:

a polyester film substrate;

first and second conductive traces supported by the substrate, the first trace having a first terminal and the second trace having a second terminal spaced apart from the first terminal by a gap;

an integrated circuit supported by the substrate and coupled to at least one of the conductive traces, the integrated circuit defining a wireless identification device and including a microprocessor, a microwave receiver coupled to the microprocessor, a backscatter modulator coupled to the microprocessor, and a memory coupled to the microprocessor;

a battery supported by the substrate and coupled to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, integrated circuit, and battery, when the first terminal is coupled to the second terminal;

conductive epoxy at least in part supporting the battery from the substrate and coupling the battery to the at least one conductive trace; and

a jumper electrically closing the gap and completing the circuit, the jumper consisting essentially of conductive epoxy having a resistance of less than 1000 ohms prior to curing.

17. An electronic circuit in accordance with claim 16 wherein the receiver is configured to receive microwave frequencies.

18. An electronic circuit in accordance with claim 16 wherein the modulator is a backscatter modulator.

19. An electronic circuit comprising:

a polyester film substrate;

first and second conductive traces supported by the substrate, the first trace having a first portion and the second trace having a second portion spaced apart from the first portion by a gap;

an integrated circuit attached to the substrate and coupled to at least one of the conductive traces, the integrated circuit defining a wireless identification device and including a microprocessor, a microwave receiver coupled to the microprocessor, a backscatter modulator coupled to the microprocessor, and a memory coupled to the microprocessor;

a battery supported on the substrate and coupled to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, integrated circuit, and battery, if the first portion was coupled to the second portion;

conductive epoxy at least in part supporting the battery from the substrate and coupling the battery to the at least one conductive trace; and

a jumper electrically closing the gap and completing the circuit, the jumper comprising a discrete component resistor across the gap, wherein the conductive epoxy couples the resistor to the conductive traces on either side of the gap.

20. An electronic circuit in accordance with claim 19 wherein the receiver is configured to receive microwave frequencies.

21. An electronic circuit in accordance with claim 19 wherein the modulator is a backscatter modulator.

22. An electronic circuit comprising:

a polyester film substrate;

first and second conductive traces on the substrate, the first trace having a first portion and the second trace having a second portion spaced apart from the first portion by a gap, wherein the size of the gap is approximately 30 thousandths of an inch;

an integrated circuit attached to the substrate and coupled to at least one of the conductive traces, the integrated circuit including a microprocessor;

a battery supported on the substrate and coupled to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, integrated circuit, and battery, if the first portion was coupled to the second portion;

conductive epoxy at least in part supporting the battery from the substrate and coupling the battery to the at least one conductive trace;

conductive epoxy on the first portion, and conductive epoxy on the second portion; and

a jumper electrically closing the gap and completing the circuit, the jumper consisting essentially of a drop of conductive epoxy having a resistance of less than 1000 ohms prior to curing.

23. An electronic circuit in accordance with claim 22 wherein the receiver is configured to receive microwave frequencies.

24. An electronic circuit in accordance with claim 22 wherein the modulator is a backscatter modulator.