Dissipative ceramic bonding tip

CAFC
  • US 6,354,479 B1
  • Filed: 02/25/2000
  • Issued: 03/12/2002
  • Est. Priority Date: 02/25/1999
  • Status: Expired due to Term
First Claim
Patent Images

1. A tip having a dissipative material for use in wire bonding machines for connecting leads on integrated circuit bonding pads, wherein said dissipative material has a resistance low enough to prevent a discharge of charge to a device being bonded and high enough to avoid current flow large enough to damage said device being bonded.

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