Spring structure with self-aligned release material

• US 6,361,331 B2
• Filed: 08/06/2001
• Issued: 03/26/2002
• Est. Priority Date: 07/27/2000
• Status: Expired due to Term

• Current Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Original Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Inventors: Lu, JengPing, Ho, Jackson, Fork, David Kirtland, Lau, Rachel King-ha
• Primary Examiner(s): Patel, Tulsidas
• Assistant Examiner(s): DINH, PHUONG K
• Application Number:
  US09/923,600
• Publication Number:
  US 20020013070A1
• Time in Patent Office: 232 Days
• Field of Search: 439/81, 174/260, 174/259, 324/275, 324/754
• US Class Current: 439/81
• CPC Class Codes: B81B 2203/0118 Cantilevers
• CPC Class Codes: B81C 1/00484 Processes for releasing structures not provided for in group B81C1/00476
• CPC Class Codes: B81C 2201/0136 by doping limited material regions
• CPC Class Codes: B81C 2203/058 Aligning components using methods not provided for in B81C2203/051 - B81C2203/052
• CPC Class Codes: G01R 1/06716 Elastic
• CPC Class Codes: G01R 1/06727 Cantilever beams
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: H01R 4/48 utilising a spring, clip, or other resilient member H01R4/52 takes precedence
• CPC Class Codes: H05K 3/4092 Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49135 and shaping, e.g., cutting or bending, etc.
• CPC Class Codes: Y10T 29/4914 with deforming of lead or terminal

Abstract

Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad or metal via, and also to further anchor the spring metal finger to the substrate.

Claims

1. A spring structure comprising:

a substrate;

a release material portion located over the substrate; and

a spring metal finger having an anchor portion attached to the release material pad such that the release material portion is located between the anchor portion and the substrate, the spring metal finger also having a free portion extending over the substrate,

wherein the release material portion is self-aligned to the anchor portion of the spring metal finger.

2. The spring structure according to claim 1, wherein the release material portion is electrically conductive.

3. The spring structure according to claim 1, wherein the release material portion comprises heavily doped silicon.

4. The spring structure according to claim 1, wherein the release material portion comprises at least one metal selected from the group consisting of Ti, Cu, Al, Ni, Zr, and Co.

5. The spring structure according to claim 1, wherein the release material portion comprises a multi-layer structure.

6. The spring structure according to claim 1,

wherein a contact pad is provided on the substrate,

wherein the release material portion is formed adjacent to the contact pad, and

wherein the spring structure further comprises a metal strap electrically connecting the anchor portion of the spring metal finger to the contact pad.

7. The spring structure according to claim 6, wherein the release material portion is electrically non-conductive.

8. The spring structure according to claim 7, wherein the release material portion comprises silicon nitride.

9. The spring structure according to claim 1, further comprising a wiring pattern located between the release material portion and the substrate.

10. The spring structure according to claim 1, further comprising a conductor located between the release material portion and the substrate, wherein the conductor is also self-aligned to the spring metal finger.

11. The spring structure according to claim 10, further comprising:

a wiring pattern formed on the substrate;

a dielectric layer formed on the wiring pattern; and

a metal via extending between the wiring pattern and the conductor through the dielectric layer.

12. The spring structure according to claim 10, further comprising a contact pad provided on the substrate, wherein the conductor is formed on an upper surface of the contact pad.

13. The spring structure according to claim 1, further comprising plated metal formed on the anchor portion of the spring metal finger, wherein the anchor portion is self-aligned to the plated metal.

14. The spring structure according to claim 13, further comprising a passivation metal formed between the plated metal and the anchor portion.

15. A spring structure comprising:

a substrate;

a release material portion located over the substrate; and

a spring metal finger having an anchor portion attached to the release material pad such that the release material portion is located between the anchor portion and the substrate, the spring metal finger also having a free portion extending over the substrate,

wherein an edge of the release material portion is substantially aligned with a corresponding edge of the anchor portion of the spring metal finger.

16. A spring structure comprising:

a substrate;

a release material portion located over the substrate; and

a spring metal finger having an anchor portion attached to the release material pad such that the release material portion is located between the anchor portion and the substrate, the spring metal finger also having a free portion extending over the substrate,

wherein the anchor portion of the spring metal finger includes an outer edge, and

wherein the release material portion includes an outer edge that forms a skirt around the outer edge of the anchor portion.

17. The spring structure according to claim 16,

wherein the outer edge of the anchor portion includes a first edge and a second edge forming a corner,

wherein the outer edge of the release material includes a third edge and a fourth edge, the third edge extending parallel to the first edge such that a first skirt portion is formed between the first edge and the third edge, the fourth edge extending parallel to the second edge such that a second skirt portion is formed between the second edge and the fourth edge, and

wherein a width of the first skirt portion is equal to a width of the second skirt portion.